Two-Substrate Assembly for Chip Strain Relief Without Reinforcement
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Solution Overview
Problem
Substrates with mounted chip parts can be distorted by heavy components, leading to potential damage of the chip parts, and existing solutions require additional reinforcing parts, increasing the parts count.
Innovation Solution
A method involving a first substrate with chip parts and a second substrate connected at two predetermined points, where the strain of the chip parts is managed within specific ranges to prevent distortion without additional reinforcing parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional lithography is used to form transistor gates, then manufacturing process is simple, but manufacturing precision deteriorates due to inability to form precise fin structures
Solution Approach 1:
The substrate is segmented into multiple layers including a first substrate layer, a second substrate layer, and an intermediate layer with through-opening. The fin structures are formed by segmenting the substrate into discrete regions defined by the intermediate layer pattern, allowing precise fin formation through selective etching through the through-opening.
Solution Approach 2:
The intermediate layer with the through-opening is formed preliminarily before fin structure formation. This pre-formed pattern defines the exact locations where fins will be created, ensuring manufacturing precision is achieved before the actual fin formation process begins.
2Reliability
If substrate thickness is reduced to improve device performance, then device performance improves, but substrate mechanical strength deteriorates
Solution Approach 1:
The substrate is constructed as a composite structure with multiple layers including a first substrate layer, a second substrate layer, and an intermediate layer. This composite configuration provides enhanced mechanical strength while maintaining reduced overall thickness, resolving the contradiction between device performance and substrate strength.
Solution Approach 2:
The intermediate layer is nested between the first and second substrate layers, creating a multi-layer nested structure. This nested configuration distributes mechanical stresses across multiple interfaces, maintaining substrate strength despite reduced overall thickness.
3Manufacturing precision
If through-opening is formed in intermediate layer to form fins, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The intermediate layer with the through-opening serves multiple functions: it defines fin locations, acts as an etch stop layer, and provides structural support. This multi-functionality reduces the need for additional specialized layers, offsetting the complexity increase from the through-opening formation.
Data Source
Figure 1
Figure 2
AI summary
A second substrate (20) is connected to a first substrate (10). A first chip part (11) has a strain equal to or more than a predetermined value which is from 500 µST to 4000 µST inclusive in a non-connected state where the second substrate (20) is not connected to the first substrate (10) and the first substrate (10) is supported at two predetermined points (30a, 30b), and the strain of the first chip part (11) is equal to or less than the predetermined value in a connected state where the second substrate (20) is connected to the first substrate (10) and the first substrate (10) is supported at the two predetermined points (30a, 30b).