Substrate Assembly Heat Dissipation for Co-Packaged Optics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As communication traffic increases, network switch devices with Co-Packaged Optics (CPO) face challenges in efficiently dissipating heat generated by both the switch Application Specific Integrated Circuit (ASIC) and optical transceivers, leading to a need for improved heat management solutions.
Innovation Solution
A substrate assembly is designed with a heat dissipation mechanism that includes a substrate with a first surface and a second surface, where optical transceivers are fixed with their electrical interface and heat dissipation portion aligned in a direction intersecting the first direction, and a first heat dissipation mechanism thermally connected to the substrate, utilizing materials like aluminum-based metal for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If optical transceivers are mounted on the substrate with conventional heat dissipation methods, then the device structure is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
A heat dissipation plate is introduced as an intermediary component between the optical transceiver and the substrate. The plate is thermally connected to the heat dissipation portion of the optical transceiver and extends toward the substrate, facilitating efficient heat transfer from the transceiver to the substrate without requiring complex direct thermal coupling mechanisms.
2Temperature
If the heat dissipation mechanism is added to improve thermal management, then heat dissipation efficiency improves, but manufacturing cost and assembly labor increase
Solution Approach 1:
The heat dissipation plate serves multiple functions: it provides thermal coupling between the optical transceiver and substrate, acts as a mechanical support structure, and facilitates heat distribution across the substrate. This multi-functionality reduces the need for separate components and simplifies the manufacturing process.
Solution Approach 2:
The heat dissipation mechanism is merged with the substrate structure, where the heat dissipation plate is integrated into the substrate assembly. This integration allows for simplified manufacturing where the heat dissipation function is combined with the structural support function, reducing assembly steps and labor requirements.
3Temperature
If the optical transceiver is fixed with electrical interface and heat dissipation portion aligned in intersecting direction, then heat transfer path is optimized, but space utilization and component layout become more complex
Solution Approach 1:
The heat dissipation plate extends in a direction that is not limited to the conventional planar layout, utilizing the vertical dimension and lateral extension simultaneously. The plate extends from beneath the optical transceiver in the vertical direction and also extends laterally toward the substrate, creating a three-dimensional heat transfer path that optimizes thermal coupling while managing spatial constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from optical transceivers while minimizing interference with other components, enhancing the thermal management of network switch devices and reducing manufacturing costs and labor through shared fixing mechanisms.
Implementation Method 1
a first heat dissipation mechanism fixed to the substrate, the first heat dissipation mechanism including a first portion adjacent to the heat dissipation portion in the first direction and thermally connected with the heat dissipation portion
Data Source
AI summary
A substrate assembly includes: a substrate including a first surface facing a first direction, a second surface on a side opposite to the first surface, the second surface facing an opposite direction to the first direction, and an optical transceiver including a first electrical interface, and a heat dissipation portion, the optical transceiver being fixed to the substrate in a state where the first electrical interface and the heat dissipation portion face the opposite direction to the first direction and are aligned in a direction intersecting the first direction; and a first heat dissipation mechanism fixed to the substrate, the first heat dissipation mechanism including a first portion adjacent to the heat dissipation portion in the first direction and thermally connected with the heat dissipation portion in a state where the optical transceiver is fixed to the substrate.