Substrate Assembly Layout for ESD-Resistant Overlapping Conductive Lines
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Solution Overview
Problem
Electrostatic discharge during the fabrication of display devices can cause malfunctions due to the accumulation of electrostatic charges, leading to reduced production yield, as the delicate components and wiring are prone to damage from such discharges.
Innovation Solution
A substrate assembly with a specific configuration of conductive lines on a substrate, where the distance between overlapping conductive lines is optimized (between 3500 and 4500 angstroms) to reduce the likelihood of electrostatic discharge by increasing the distance and thereby minimizing the risk of passivation layer punch-through.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the distance between overlapping conductive lines is reduced to minimize device area, then the area occupied by conductive lines is reduced, but the risk of electrostatic discharge increases due to closer proximity
Solution Approach 1:
The patent applies different spacing distances to different regions of the conductive lines. Specifically, in overlapping regions where electrostatic discharge risk is highest, a larger distance (3500-4500 angstroms) is maintained between the first and second conductive lines. In non-overlapping regions, the spacing can be reduced. This local differentiation of spacing quality allows the device to minimize overall area while protecting critical overlapping areas from electrostatic damage.
2Reliability
If the distance between overlapping conductive lines is increased to reduce electrostatic discharge, then the reliability against electrostatic damage is improved, but the area occupied by conductive lines increases
Solution Approach 1:
The patent implements location-dependent spacing where the distance between conductive lines is optimized for each specific region. In overlapping regions susceptible to electrostatic discharge, the spacing is increased to 3500-4500 angstroms. In non-overlapping or less critical regions, the spacing is reduced. This selective application of spacing quality ensures reliability where needed while minimizing overall area consumption.
3Reliability
If a passivation layer is placed between overlapping conductive lines to prevent electrostatic discharge, then the protection against electrostatic damage is improved, but the manufacturing complexity increases due to additional layer formation
Solution Approach 1:
Instead of adding a passivation layer (which would increase manufacturing complexity), the patent changes the geometric parameter - specifically the spacing distance - between the first and second conductive lines. By increasing the distance to 3500-4500 angstroms in overlapping regions, the electric field strength is reduced, preventing electrostatic discharge without requiring additional material layers. This parameter change approach maintains manufacturing simplicity while achieving the desired protection.
Data Source
AI summary
A substrate assembly and a display device are provided. The substrate assembly includes a substrate, a first conductive line, and a second conductive line. The first conductive line is disposed on the substrate, wherein a voltage is applied to the first conductive line. The second conductive line is disposed on the substrate, wherein in a top view, at least a portion of the second conductive line extends along a first direction. The first conductive line and the second conductive line are at least partially overlapped in a normal direction of the substrate. A distance between the first conductive line and the second conductive line in the normal direction is greater than or equal to 3500 angstroms, and less than or equal to 4500 angstroms.