Semiconductor Component Structure With Through-Insulation Heat Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power module semiconductor devices face challenges in downsizing due to the need for extended terminal electrodes to dissipate heat, which also requires the use of bonding wires, limiting heat dissipation efficiency and increasing component size.
Innovation Solution
The design exposes the second main surface of the substrate, allowing heat to dissipate directly from the chip without extending external terminals, eliminating the need for bonding wires and enabling a more compact layout by forming external terminals that penetrate through a sealing insulation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If terminal electrodes are extended from the side surface of the ceramic substrate to dissipate heat, then heat dissipation is improved, but the component size increases and bonding wires are required
Solution Approach 1:
The patent changes the heat dissipation direction from horizontal (side surface extension) to vertical (through-substrate penetration). External terminals penetrate through the ceramic substrate from the first main surface to the second main surface, allowing heat to be dissipated through the thickness direction of the substrate rather than requiring lateral extension. This dimensional change enables effective heat dissipation without increasing the component's planar footprint.
Solution Approach 2:
The patent extracts and eliminates the bonding wires from the conventional structure. By directly penetrating the external terminals through the ceramic substrate to connect with the semiconductor device, the design removes the intermediate bonding wire connection, reducing part count and simplifying the overall structure while maintaining electrical and thermal connectivity.
2Temperature
If terminal electrodes are extended from the side surface of the ceramic substrate, then heat dissipation is improved, but device complexity increases due to additional connection members
Solution Approach 1:
The patent merges the electrical connection function and the heat dissipation function into a single integrated structure. The external terminals that penetrate through the ceramic substrate serve dual purposes: providing electrical connection between the semiconductor device and external circuits, and simultaneously conducting heat away from the semiconductor device. This consolidation eliminates the need for separate bonding wires and simplifies the overall device architecture.
Solution Approach 2:
The external terminals penetrating through the ceramic substrate perform multiple functions simultaneously: electrical conduction, thermal conduction, and mechanical support. This multi-functional design reduces the number of separate components needed and simplifies the overall structure while achieving effective heat dissipation.
3Reliability
If the entire outer surface of the ceramic substrate is covered with resin layer, then sealing is improved, but heat dissipation is hindered
Solution Approach 1:
The patent segments the resin layer coverage to create heat dissipation pathways. Instead of completely covering the outer surfaces, the resin layer is configured to leave exposed regions around the penetrating external terminals. This segmented approach allows the resin to provide sealing and protection in non-critical areas while maintaining thermal pathways for heat dissipation through the exposed terminal regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation while reducing component size and improving dielectric strength, allowing for more efficient thermal management and reduced part count, thereby achieving downsizing and improved thermal performance simultaneously.
Implementation Method 1
heat generated in the chip can be dissipated to the outside from the second main surface of the substrate
Data Source
AI summary
An electronic component includes a substrate having a first main surface on one side and a second main surface on the other side, a chip having a first chip main surface on one side and a second chip main surface on the other side, and a plurality of electrodes formed on the first chip main surface and/or the second chip main surface, the chip being arranged on the first main surface of the substrate, a sealing insulation layer that seals the chip on the first main surface of the substrate such that the second main surface of the substrate is exposed, the sealing insulation layer having a sealing main surface that opposes the first main surface of the substrate, and a plurality of external terminals formed to penetrate through the sealing insulation layer so as to be exposed from the sealing main surface of the sealing insulation layer, the external terminals being respectively electrically connected to the plurality of electrodes of the chip.