Substrate Gripping Base Plate Drainage for Low-Rotation Processing
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Solution Overview
Problem
In substrate processing apparatuses, when substrates are processed at a low number of rotations, processing liquids supplied to the substrates can flow to the upper surface of the base plate through the gripping mechanism, potentially hindering the operation of driving units such as rotating shafts and lift pins.
Innovation Solution
The substrate processing apparatus includes a base plate with liquid drain holes that discharge processing liquids flowing from the substrate to the upper surface of the base plate, preventing these liquids from reaching and interfering with the driving units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are processed at a low number of rotations, then processing can be performed under gentle conditions, but processing liquids flow to the upper surface of the base plate through the gripping mechanism and may interfere with driving units
Solution Approach 1:
The harmful processing liquid is extracted from the base plate surface through dedicated discharge paths. The liquid discharge holes are formed in the base plate to guide and remove processing liquid that has flowed onto the upper surface, preventing it from reaching and interfering with the driving units located beneath the base plate.
Solution Approach 2:
The liquid discharge holes act as an intermediary channel between the base plate upper surface and the liquid collection area. This intermediary structure provides a controlled path for processing liquid to exit the base plate area, preventing direct contact between the liquid and the driving units while maintaining the gentle processing conditions.
2Ease of manufacture
If the base plate structure is simplified, then manufacturing cost is reduced, but there is no provision to discharge processing liquid that flows onto the base plate surface
Solution Approach 1:
The base plate is segmented with multiple liquid discharge holes distributed across its upper surface. These holes divide the liquid discharge function into multiple locations, allowing processing liquid to be discharged at various points where it may accumulate, providing comprehensive protection against liquid interference with driving units while maintaining a relatively simple overall base plate structure.
3Reliability
If liquid drain holes are added to the base plate, then processing liquid discharge is enabled, but the base plate structure becomes more complex
Solution Approach 1:
The base plate incorporates liquid discharge holes that create a porous-like structure for fluid passage. This allows the base plate to maintain its structural integrity while providing multiple pathways for processing liquid to pass through, achieving reliable liquid discharge with minimal added complexity compared to a completely enclosed solid plate design.
Data Source
AI summary
A substrate processing apparatus according to the present disclosure includes a gripping mechanism and a base plate. The gripping mechanism grips a peripheral edge of a substrate. The base plate is located below the substrate gripped by the gripping mechanism and supports the gripping mechanism. Furthermore, the base plate includes a liquid drain hole that discharges a processing liquid flowing from the substrate to an upper surface of the base plate through the gripping mechanism.