Multi-Path Fluid Supply for Uniform Substrate Bath Flow

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Solution Overview

Problem

Conventional substrate processing apparatuses face challenges in generating uniform liquid flow within the processing tub, leading to biased liquid flow distribution among substrates due to inconsistent gas supply, resulting in uneven processing outcomes.

Innovation Solution

The apparatus incorporates a fluid supply system with multiple discharge paths that can individually control the flow rate and timing of gas discharge to different regions, ensuring uniform liquid flow generation by optimizing the placement and adjustment of discharge paths based on substrate arrangement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a gas supply is provided within the processing tub to generate liquid flow, then liquid flow is generated within the processing tub, but uniform liquid flow distribution among substrates is difficult to achieve

Engineering Contradiction:
Improveliquid flow generationVSAvoiduniformity of substrate processing
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The gas supply system is divided into multiple discharge paths (first discharge path and second discharge path) that discharge gas to different regions in the arrangement direction of substrates. Each discharge path can be controlled independently to achieve uniform liquid flow distribution across all substrates, resolving the contradiction between generating sufficient liquid flow and maintaining uniformity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions in the arrangement direction of substrates are provided with different discharge paths that can be controlled independently. This allows local adjustment of gas discharge to each region, ensuring that liquid flow is uniformly distributed across all substrates while maintaining overall liquid flow generation.

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If gas is supplied uniformly to all regions, then liquid flow is generated, but biased liquid flow distribution occurs among substrates

Engineering Contradiction:
Improveliquid flow generationVSAvoidliquid flow distribution uniformity
Core Design Contradiction:
Quantity of substanceVSEase of operation

Solution Approach 1:

The gas supply is segmented into multiple discharge paths positioned at different locations in the arrangement direction of substrates. Each discharge path can be controlled independently, allowing the system to generate liquid flow while avoiding biased distribution by adjusting each region's gas supply individually.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The gas discharge control is made dynamic by enabling independent adjustment of each discharge path. This allows the system to adaptively control liquid flow distribution to achieve uniformity across substrates, transforming a static uniform supply into a dynamically adjustable multi-region supply system.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for a more uniform and appropriate liquid flow within the processing tub, enhancing the consistency of substrate processing and reducing biases in etching and other processing operations.

Implementation Method 1

a gas supply configured to supply a gas such as a nitrogen gas may be provided within the processing tub to generate a liquid flow within the processing tub

Methodology Applied
Scientific EffectGas supply generates liquid flow: Convection

Data Source

PatentUS11742223B2Substrate processing apparatus
Publication Date: 2023.08.29 TOKYO ELECTRON LTD
  • US11742223B2 patent drawing
  • US11742223B2 patent drawing
  • US11742223B2 patent drawing

AI summary

A substrate processing apparatus comprises a processing tub and a fluid supply. In the processing tub, a processing is performed on multiple substrates by immersing the multiple substrates in a processing liquid. The fluid supply is disposed under the multiple substrates within the processing tub and configured to discharge a fluid to generate a liquid flow of the processing liquid within the processing tub. Further, the fluid supply includes multiple discharge paths configured to discharge the fluid to different regions in an arrangement direction of the multiple substrates.