Substrate Bending Correction via Reference Mark Alignment
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Solution Overview
Problem
The existing methods for measuring structures on substrates with coordinate measuring machines are inefficient due to the variability in substrate placement and orientation, leading to inconsistent bending measurements and reduced throughput, as the degree of bending must be recalculated for each newly inserted substrate.
Innovation Solution
A method to determine correction values for the bending of a substrate based on its alignment relative to the coordinate system of a coordinate measuring machine, involving the calculation of the substrate's degree of bending using known correction values, determination of reference marks' positions, and automatic alignment with the machine's coordinate system, allowing for precise correction of measured values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the degree of bending is recalculated for each newly inserted substrate, then measurement accuracy is maintained, but throughput is reduced
Solution Approach 1:
The patent applies preliminary action by pre-calculating and storing correction values for substrate bending in a database before actual measurement. When a substrate is inserted, the system retrieves the appropriate correction values based on substrate type and support point configuration, eliminating the need to recalculate bending degrees for each new substrate and thus maintaining both accuracy and throughput.
Solution Approach 2:
The patent uses copying by creating a database of pre-calculated correction values that represents the bending characteristics of different substrate types. Instead of performing complex calculations in real-time for each substrate, the system copies and retrieves pre-computed correction data, significantly reducing measurement time while maintaining precision.
2Measurement precision
If correction values are determined based on substrate alignment, then measurement consistency is improved, but device complexity increases
Solution Approach 1:
The patent introduces an intermediary approach by using a database as a mediator between the physical measurement process and the correction calculation. The database stores correction values that bridge the gap between raw measurement data and accurate results, simplifying the overall system architecture by pre-computing complex bending corrections rather than requiring real-time complex calculations.
Solution Approach 2:
The patent applies parameter changes by transforming the complex geometric problem of substrate bending into a lookup table of correction values. Instead of performing complex real-time calculations based on substrate alignment, the system uses pre-computed correction parameters stored in the database, reducing computational complexity while maintaining measurement consistency.
Data Source
AI summary
A method for allocating correction values of the degree of bending of a substrate (2) relative to a coordinate system (40) of a coordinate measuring machine (1) is disclosed. The positions of the at least two reference marks (32) on the substrate holder (27) are automatically determined relative to the coordinate system (40) of the coordinate measuring machine (1) for each substrate (2) currently placed in the substrate holder (27) in the coordinate measuring machine (1).