Wider Substrate Block for PoP Assembly Handling
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Solution Overview
Problem
Traditional substrate bars used in package-on-package (PoP) structures are fragile, difficult to handle, and hard to position accurately due to their thin and long design, leading to manufacturing challenges and increased complexity in assembly processes.
Innovation Solution
A wider substrate block with two bars that extend laterally to the carrier's edge, allowing for easier handling and assembly, featuring filled vias for electrical connections and made from materials like silicon or glass, which can be singulated to expose one side for improved positioning and reduced breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional thin and long substrate bars are used, then electrical connections between top and bottom packages are achieved, but the substrate bars are fragile, difficult to handle, and hard to position accurately
Solution Approach 1:
The substrate bar is divided into two separate bars that are positioned on opposite sides of the die. Each bar is shorter and less fragile than a single long bar would be, yet together they provide the necessary electrical connections and structural support
Solution Approach 2:
Instead of using a single long bar extending in one dimension, the solution uses two bars positioned in different spatial locations, effectively distributing the function across multiple dimensions and reducing the length requirement for each individual bar
2Manufacturing precision
If traditional thin and long substrate bars are used, then electrical connections are established, but accurate positioning on the carrier substrate is difficult
Solution Approach 1:
Dividing the single long bar into two separate bars creates smaller, more manageable components that are easier to position accurately on the carrier substrate during assembly
Solution Approach 2:
The two substrate bars act as intermediaries that simplify the assembly process by providing distinct, separable connection points that are easier to align and position than a single long bar
3Reliability
If substrate bars are completely surrounded by molding compound, then electrical connections are protected, but lateral edges are not exposed limiting handling options
Solution Approach 1:
The molding compound selectively exposes the lateral edges of the substrate bars while still protecting the electrical connections. This local differentiation allows the bars to be both protected and accessible for handling as needed
Data Source
AI summary
A substrate block is provided that has an increased width. The substrate block comprises two substrate bars, and the substrate bars each comprise a substrate and a plurality of filled vias through the substrate. The substrate block may be used to manufacture package substrates, and these package substrate may be incorporated into a PoP structure. The package substrate includes a carrier having a plurality of vertical interconnections and a bar coupled to the vertical interconnections.