Hermetic Substrate Stack Bond Inspection by Radiative Reflection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing hermetically sealed enclosures face challenges in determining the quality of the hermetic assembly, making it difficult to assess whether the produced enclosures meet quality requirements, leading to potential premature failure and user claims.
Innovation Solution
A process involving the planar arrangement of substrates with a transparent material to form a substrate stack, detecting radiative reflections to ascertain bond quality indices (Q1 and Q2) before and after laser bonding, ensuring a direct and hermetic joining of substrates without adhesives, and evaluating the quality based on distance profiles and interference patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetic assembly is performed without quality detection, then production process is simple, but enclosure quality cannot be assured leading to premature failure
Solution Approach 1:
The patent performs quality detection of the hermetic assembly before final enclosure completion. By detecting radiative reflection and determining bond quality indices Q1 and Q2 at intermediate stages, the system identifies potential defects early in the production process, allowing corrective actions before the enclosure is finalized and preventing premature failures.
Solution Approach 2:
The patent replaces complex mechanical quality inspection systems with an optical detection method. By irradiating the hermetic assembly with radiative input and analyzing the reflected radiation, the system determines bond quality indices without requiring physical contact or complex mechanical testing apparatus, thus improving reliability while controlling device complexity.
2Manufacturing precision
If quality detection is performed, then enclosure quality can be assessed, but production time increases
Solution Approach 1:
The quality detection is performed at an intermediate stage during the production process, before final enclosure completion. This preliminary detection allows for early identification of defects and immediate corrective actions, preventing rework later in the process and actually reducing total production time while improving manufacturing precision.
Solution Approach 2:
The optical detection method using radiative reflection analysis provides rapid quality assessment without requiring time-consuming mechanical testing or waiting for operational failure. The bond quality indices Q1 and Q2 are determined quickly through non-contact optical measurement, maintaining fast production cycles while achieving precise quality assessment.
3Reliability
If adhesive bonding is used, then substrate joining is simple, but hermetic seal reliability is reduced
Solution Approach 1:
The patent extracts and eliminates the adhesive layer from the substrate joining process. By directly bonding the first substrate to the second substrate without adhesive, the hermetic seal reliability is improved as there are no adhesive-related defects such as voids, delamination, or contamination. The laser-based direct bonding method maintains ease of manufacture through automated processing.
Solution Approach 2:
The patent changes the bonding parameters by using laser energy to directly bond substrates at controlled temperatures and energies. This parameter change enables direct substrate-to-substrate bonding without adhesive, achieving both hermetic seal reliability and manufacturing simplicity through precise control of the bonding process parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for reliable assessment of bond quality, ensuring a hermetic seal with high reliability and longevity by identifying defects and optimizing the bonding process, thereby improving the quality and durability of the enclosures.
Implementation Method 1
the first substrate (3) comprises a transparent material at least regionally and/or at least for one wavelength range, in particular for the wavelength range of the laser to be used for the direct laser bonding
Implementation Method 2
direct laser bonding with a laser beam (6) which reaches into the first substrate (3) and into the second substrate (4) and forms a bonding zone (6) in which the first substrate (3) and the second substrate (4) are directly and unmediatedly joined to one another
Implementation Method 3
forms a bonding zone (6) in which the first substrate (3) and the second substrate (4) are directly and unmediatedly joined to one another
Implementation Method 4
detecting a radiative reflection which comes about through irradiation of the substrate stack with a radiative input on the at least one contact area
Implementation Method 5
evaluating the quality based on distance profiles and interference patterns
Data Source
AI summary
A process for producing and/or checking an assembly of a substrate stack includes: planarly arranging at least one first substrate against a second substrate to form the substrate stack, the at least one first substrate and the second substrate being arranged directly against one another or on one another, so that at least one contact area is formed between the least one first substrate and the second substrate at which the at least one first substrate is in direct planar contact with the second substrate, the at least one first substrate including a transparent material; detecting a radiative reflection which comes about through irradiation of the substrate stack with a radiative input on the at least one contact area; and ascertaining a first bond quality index (Q1) of the contact area from the radiative reflection.