Substrate Support Sealing Structure for Bonder Etch Protection
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Solution Overview
Problem
The bonder in substrate processing apparatuses is exposed to etching gas during plasma reactions, leading to damage and reduced substrate quality due to particle generation, which decreases operational efficiency and requires frequent replacements.
Innovation Solution
A sealing member is disposed around the side surface of the bonder to prevent damage from etching gas, and a barrier with a groove is used to further protect the bonder, reducing exposure to processing gases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the bonder is exposed to etching gas during plasma reactions, then the substrate processing can be performed, but the bonder is etched and damaged generating particles that affect substrate quality
Solution Approach 1:
The patent introduces a sealing member that divides the space around the bonder into a protected inner region and an exposed outer region. The sealing member is positioned between the bonder and the etching gas flow, segmenting the harmful gas exposure and protecting the bonder while allowing the plasma reaction to proceed in the chamber.
Solution Approach 2:
The sealing member acts as an intermediary element between the etching gas and the bonder. It intercepts the etching gas before it reaches the bonder, preventing direct contact and etching damage. The sealing member is specifically designed to be resistant to etching gas while the bonder remains vulnerable, making it an effective protective mediator.
2Reliability
If the sealing member is disposed around the bonder to protect it from etching gas, then the bonder reliability is improved, but the device structure becomes more complex
Solution Approach 1:
The sealing member is designed as a thin, flexible protective barrier that can be disposed around the bonder. This thin-film approach provides effective sealing and protection without adding significant structural complexity or bulk to the device. The flexible nature allows it to conform to the bonder geometry while maintaining a simple overall structure.
Solution Approach 2:
The sealing member is positioned in a specific spatial dimension between the etching gas flow and the bonder surface. By utilizing the vertical or radial dimension around the bonder, the sealing member creates a protective barrier without complicating the horizontal or planar structure of the device. This dimensional placement allows protection with minimal structural addition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sealing member effectively protects the bonder from etching gas, enhancing the reliability and longevity of the substrate processing apparatus by minimizing damage and maintaining substrate quality.
Implementation Method 1
a sealing member disposed around a side surface of the bonder to prevent damage to the bonder
Implementation Method 2
the support plate may include a DC electrode configured to fix the substrate supported on an upper end of the support plate by using electrostatic force
Implementation Method 3
the support plate may include a radio frequency (RF) layer configured to form an electromagnetic field by receiving power from an RF power source
Implementation Method 4
at least one suction hole may be formed in an upper end of the thermal insulation layer to fix the support plate by vacuum suction, wherein the substrate processing apparatus may further include a vacuum pump communicating with the at least one suction hole to form a vacuum pressure in the at least one suction hole
Data Source
AI summary
Provided is a substrate processing apparatus. The substrate processing apparatus includes a support plate configured to support a substrate, a base plate under the support plate, a thermal insulation layer between the support plate and the base plate, a bonder bonding the base plate and the thermal insulation layer to each other, and a sealing member disposed around a side surface of the bonder to prevent damage to the bonder.