Substrate Bonding Alignment Using Feedback From Prior Bonding
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Solution Overview
Problem
Existing bonding systems face challenges in accurately adjusting the position of substrates in the horizontal direction before bonding, leading to potential misalignment and defects in the bonding process.
Innovation Solution
A bonding system that includes a first and second holder with attraction surfaces, a position adjuster to move the holders relative to each other in the horizontal direction, a pressing unit to bond the substrates, a measuring unit to assess position deviations, and a controller to adjust positions based on previous bonding data, ensuring precise alignment and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a bonding apparatus uses imaging devices to measure alignment marks and adjust holder positions, then bonding alignment accuracy is improved, but the system complexity and adjustment time increase
Solution Approach 1:
The bonding apparatus employs imaging devices to capture alignment marks on substrates, measures their positions, and feeds this information back to the control unit. The control unit then adjusts the holder positions based on this feedback to achieve precise alignment before bonding, resolving the contradiction by implementing a closed-loop control system that improves accuracy while managing complexity through automated feedback mechanisms.
Solution Approach 2:
The system replaces manual alignment operations with an automated imaging and control system. Instead of mechanical adjustment alone, optical imaging devices capture alignment mark positions, and a control unit processes this data to drive precise mechanical adjustments of the holders, substituting manual mechanical alignment with an automated opto-mechanical system that improves precision.
2Manufacturing precision
If the bonding apparatus performs position adjustment based on real-time measurement, then alignment accuracy is improved, but the bonding process time increases
Solution Approach 1:
The bonding apparatus performs position measurement and adjustment operations before the actual bonding process begins. By using imaging devices to capture alignment mark positions and completing all necessary holder adjustments in advance, the system ensures precise alignment is achieved prior to bonding, preventing the need for time-consuming adjustments during the bonding process itself.
Solution Approach 2:
The control unit receives measurement data from imaging devices and immediately processes it to adjust holder positions before bonding commences. This real-time feedback loop allows the system to correct alignment deviations promptly, achieving high positioning accuracy without extending the overall bonding process time, as adjustments are integrated into the pre-bonding preparation phase.
3Measurement precision
If the bonding system uses multiple imaging devices to measure alignment marks on both substrates, then measurement accuracy is improved, but the device complexity and cost increase
Solution Approach 1:
The bonding apparatus integrates multiple imaging devices into a unified measurement system under a single control unit. The upper imaging device measures alignment marks on the lower substrate, while the lower imaging device measures alignment marks on the upper substrate. The control unit consolidates data from both imaging devices to compute comprehensive position deviations and coordinate holder adjustments, merging multiple measurement functions into an integrated system that improves accuracy while managing complexity through centralized control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly improves the accuracy of position adjustment between substrates in the horizontal direction, enhancing the bonding process by reducing misalignment and defects, and allowing for real-time adjustments based on statistical analysis of position deviations.
Implementation Method 1
a first holder (140) and a second holder (141) which are arranged to be spaced apart from each other in a vertical direction, the first holder having, on a surface thereof facing the second holder, an attraction surface (140a) configured to attract and hold a first substrate
Implementation Method 2
an attraction surface configured to attract and hold a first substrate
Data Source
AI summary
A bonding system includes a first holder and a second holder arranged to be spaced apart from each other in a vertical direction; a position adjuster configured to move the first holder and the second holder relatively to perform a position adjustment in a horizontal direction between a first substrate held by the first holder and a second substrate held by the second holder; a pressing unit configured to press the first substrate and the second substrate against each other; a measuring unit configured to measure a position deviation between an alignment mark on the first substrate and an alignment mark on the second substrate, the first substrate and the second substrate being bonded by the pressing unit; and a position adjustment controller configured to control the position adjustment in the horizontal direction in a currently-performed bonding processing based on the position deviation generated in a previously-performed bonding processing.