Substrate Bonding Alignment Using Feedback-Based Position Correction
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Solution Overview
Problem
Existing bonding systems face challenges in achieving accurate and precise bonding of substrates due to limitations in aligning and positioning them correctly, leading to potential defects in the bonding process.
Innovation Solution
A bonding system that includes an upper chuck and a lower chuck with imaging devices for precise alignment, a surface modifying apparatus for hydrophilizing the substrates, and a control device for adjusting positions based on measurement data from an alignment measuring device, ensuring accurate intermolecular bonding from central to peripheral regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alignment marks are imaged and positions are adjusted based on image data, then substrate alignment is improved, but measurement precision is insufficient due to image-based indirect measurement
Solution Approach 1:
The patent replaces the optical imaging-based position detection system with a direct mechanical measurement system. A measurement device with a probe physically contacts the substrate to directly measure its position, eliminating the need for image processing and alignment mark detection. This substitution of mechanical measurement for optical measurement provides more accurate and direct position data for substrate alignment.
Solution Approach 2:
The patent introduces a measurement device as an intermediary between the substrate and the control system. This measurement device includes a probe that physically contacts the substrate and a measurement unit that processes the contact information to determine substrate position. This intermediary provides a bridge between the physical substrate and the control system, enabling precise position feedback for alignment correction.
2Reliability
If substrates are bonded from central portions to peripheral portions, then bonding reliability is improved, but bonding time increases due to sequential bonding process
Solution Approach 1:
The patent divides the bonding process into distinct stages: first bonding the central portions of the substrates, then subsequently bonding the peripheral portions. This segmentation allows the bonding process to proceed in a controlled sequence, ensuring that the central bonding is established first to provide a stable foundation, followed by peripheral bonding to complete the full substrate attachment.
Solution Approach 2:
The patent performs preliminary bonding of the central portions before completing the peripheral bonding. This preliminary action ensures that the critical central region is securely bonded first, providing structural stability and reliability, while the peripheral bonding is completed afterward to finalize the substrate attachment process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances the accuracy of substrate bonding by ensuring precise alignment and hydrophilization, resulting in improved bonding quality and reduced defects by controlling the position adjustments based on real-time measurement data.
Implementation Method 1
an upper chuck configured to attract a substrate at an upper side from above it and a lower chuck configured to attract a substrate at a lower side from below it
Implementation Method 2
a surface modifying apparatus for hydrophilizing the substrates
Implementation Method 3
the central portions of the two substrates are bonded by an intermolecular force or the like
Data Source
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AI summary
A bonding system includes a first holder and a second holder arranged to be spaced apart from each other in a vertical direction; a position adjuster configured to move the first holder and the second holder relatively to perform a position adjustment in a horizontal direction between a first substrate held by the first holder and a second substrate held by the second holder; a pressing unit configured to press the first substrate held by the first holder and the second substrate held by the second holder against each other; a measuring unit configured to measure a position deviation between an alignment mark formed on the first substrate and an alignment mark formed on the second substrate, the first substrate and the second substrate being bonded by the pressing unit; and a position adjustment controller configured to control the position adjustment in the horizontal direction in a currently-performed bonding processing based on the position deviation generated in a previously-performed bonding processing.