Substrate Bonding with Asymmetric Device Regions
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Solution Overview
Problem
The bevel edge formed during wafer thinning processes in semiconductor manufacturing leads to non-uniform stress, causing wafer cracks and delamination, necessitating a method to address and prevent these issues during substrate lamination.
Innovation Solution
A method involving the direct bonding of substrates with differently sized device regions, where the width of one device region is greater than the other, followed by thickness reduction of the second substrate to ensure proper alignment and electrical connection, thereby preventing misalignment and edge failures during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If wafer thinning process is performed, then substrate thickness is reduced, but bevel edge is formed causing non-uniform stress and potential cracks
Solution Approach 1:
The patent applies preliminary action by performing edge trimming on at least one of the first or second substrates before the bonding process. This removes the bevel edge formed during thinning in advance, preventing stress concentration and potential cracks that would occur during subsequent bonding operations, thereby maintaining wafer integrity while achieving reduced thickness
2Reliability
If substrates with different device region widths are bonded, then electrical connection is achieved, but misalignment and edge failures may occur
Solution Approach 1:
The patent applies asymmetry by intentionally creating different widths between the first substrate and second substrate through selective edge trimming. The first substrate has a first width and the second substrate has a second width that is different from the first width. This asymmetric design allows the narrower substrate to be precisely positioned and aligned on the broader substrate, ensuring accurate electrical connection between device regions while preventing edge failures during bonding
3Ease of manufacture
If bevel edge is present during bonding, then substrate lamination is simplified, but non-uniform stress causes delamination
Solution Approach 1:
The patent applies preliminary action by removing the bevel edge through edge trimming before the bonding process. This eliminates the source of non-uniform stress that would cause delamination during bonding. By preparing the substrate edges in advance, the bonding process can proceed with uniform stress distribution, ensuring stable substrate lamination without compromising the simplified bonding approach
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents misalignment and edge failures during substrate bonding, ensuring reliable electrical connections and reducing the risk of wafer cracks and delamination by aligning edges symmetrically and reducing substrate thickness to enhance bonding efficiency.
Implementation Method 1
bonding the first substrate and the second substrate to electrically connect the first device region and the second device region
Data Source
AI summary
A method of manufacturing a substrate structure includes providing a first substrate including a first device region on a first surface, providing a second substrate including a second device region on a second surface, such that a width of the first device region is greater than a width of the second device region, and bonding the first substrate and the second substrate, such that the first and second device regions are facing each other and are electrically connected to each other.