Light-Emitting Substrate Bonding Structure for Corrosion-Stable Signals
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Solution Overview
Problem
The existing Mini-LED display technologies face issues with signal transmission loss due to corrosion of bonding electrodes, leading to unstable connections between the flexible circuit board and the light-emitting substrate, resulting in poor operational performance.
Innovation Solution
A light-emitting substrate design featuring a double-layer bonding electrode structure with a conductive adhesive, where the second bonding electrode covers the first electrode, reducing exposure time and enhancing signal transmission stability, along with an insulating barrier layer to prevent short-circuits caused by residual metal, and a prop structure to maintain proper chip-substrate distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding electrodes are exposed to connect the flexible circuit board and light-emitting substrate, then electrical connection is established, but the bonding electrodes are prone to corrosion by moisture and oxygen leading to signal transmission loss
Solution Approach 1:
The patent introduces a conductive adhesive as an intermediary substance between the bonding electrodes and the flexible circuit board. This conductive adhesive layer protects the bonding electrodes from direct exposure to moisture and oxygen while maintaining electrical conductivity, thus resolving the contradiction between establishing electrical connection and preventing corrosion.
Solution Approach 2:
The bonding electrode structure uses composite materials including the bonding electrode itself, the conductive adhesive layer, and the insulating barrier layer. This multi-layer composite structure provides both electrical conductivity and protection against environmental factors, addressing the corrosion issue while maintaining signal transmission.
2Reliability
If bonding electrodes are covered to protect from corrosion, then reliability improves, but electrical connection and signal transmission may be affected
Solution Approach 1:
The conductive adhesive serves as a mediator that provides both protection and electrical connection. It covers the bonding electrode to protect from corrosion while maintaining signal transmission, thus resolving the contradiction between protection and signal transmission.
Solution Approach 2:
The patent applies different materials with different properties to different locations: the conductive adhesive is applied specifically where electrical connection is needed, while the insulating barrier layer is applied where electrical insulation is required. This localized application of different material qualities resolves the contradiction between protection and signal transmission.
3Reliability
If insulating barrier layer is added to prevent short-circuits, then electrical insulation improves, but device structure becomes more complex
Solution Approach 1:
The insulating barrier layer serves multiple functions: it provides electrical insulation to prevent short-circuits, protects the bonding electrode structure, and maintains structural integrity. By combining multiple functions into a single layer, the patent reduces overall device complexity while achieving reliable electrical insulation.
Data Source
AI summary
A light-emitting substrate includes a substrate, a first metal layer, a first insulating layer, a second metal layer and a conductive adhesive. A bonding region is proximate to a selected side edge of a first surface of the substrate. The first metal layer on the first surface includes first bonding electrodes. The first insulating layer is on the first metal layer, and a border thereof proximate to the edge is closer to the edge than a border of the first bonding electrodes facing the edge. The second metal layer includes second bonding electrodes. The conductive adhesive in the bonding region covers portions of the second bonding electrodes. A ratio of a dimension of an edge portion of the first insulating layer in a second direction to a dimension of a first bonding electrode in same direction is greater than or equal to ⅕ and less than or equal to ½.