Stacked Substrate Bonding Alignment via Crystal Structure Analysis
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Solution Overview
Problem
During the manufacturing of stacked substrates, misalignment and deformation can occur due to the anisotropy of substrates, leading to issues with bonding strength and electrical connection reliability.
Innovation Solution
A method and apparatus that acquire information about crystal structures and rigidity distributions of substrates to determine optimal combinations for bonding, aligning substrates based on these characteristics, and using an exposure device to set rotation angles for pattern formation, ensuring precise alignment and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates are bonded without considering crystal structure and rigidity distribution, then manufacturing process is simple, but misalignment and deformation occur
Solution Approach 1:
The patent applies preliminary action by acquiring crystal structure information and rigidity distribution data before the bonding process, and determining optimal substrate combinations in advance. This pre-planning allows alignment marks and bonding parameters to be set beforehand, preventing misalignment and deformation during bonding while maintaining process simplicity.
Solution Approach 2:
The patent changes physical and chemical parameters by considering crystal structure orientations and rigidity distributions when selecting substrate combinations. By adjusting these material parameters before bonding, the system achieves precise alignment without requiring complex real-time adjustment mechanisms during the bonding process.
2Reliability
If substrate combinations are selected without considering anisotropy, then bonding process is fast, but bonding strength and electrical connection reliability deteriorate
Solution Approach 1:
The patent determines optimal substrate combinations in advance by evaluating crystal structures and rigidity distributions before bonding. This preliminary selection ensures high bonding strength and electrical connection reliability while avoiding time-consuming adjustments during the bonding process itself.
Solution Approach 2:
The patent uses feedback from measured crystal structure information and rigidity distribution data to optimize substrate combinations. By incorporating this material characterization feedback into the combination selection process, the system achieves reliable bonding without requiring iterative adjustments that would extend process time.
3Manufacturing precision
If alignment is not performed based on crystal orientation and rigidity distribution, then bonding process is simple, but misalignment occurs leading to poor electrical connection
Solution Approach 1:
The patent performs preliminary alignment by determining optimal substrate combinations based on crystal orientations and rigidity distributions before bonding. Alignment mark positions and bonding parameters are calculated in advance, enabling precise alignment without requiring complex real-time alignment adjustments during bonding.
Solution Approach 2:
The patent changes alignment parameters by considering crystal structure orientations and rigidity distributions when determining substrate combinations. This approach achieves accurate alignment by adjusting material selection parameters rather than requiring complex mechanical alignment adjustments during bonding.
Data Source
AI summary
A manufacturing method for manufacturing a stacked substrate by bonding two substrates includes: acquiring information about crystal structures of a plurality of substrates; and determining a combination of two substrates to be bonded to each other, based on the information about the crystal structures. In the manufacturing method described above, the information about the crystal structures may include at least one of plane orientations of bonding surfaces and crystal orientations in a direction in parallel with the bonding surfaces. In the manufacturing methods described above, the determining may include determining a combination of the two substrates with a misalignment amount after bonding being equal to or smaller than a predetermined threshold.