Substrate Bonding Apparatus Curved Profile Alignment
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Solution Overview
Problem
In the field of semiconductor and flat panel display technologies, existing substrate bonding methods face challenges in achieving precise alignment and minimal horizontal deviation between substrates with curved surface profiles, leading to potential contact failures in stack packaging processes.
Innovation Solution
A substrate bonding apparatus is designed with an upper chuck that secures a first substrate with a concave surface profile and a lower chuck that secures a second substrate with a convex surface profile, using a chuck controller to generate a shape parameter and align the substrates, transforming the second substrate's flat profile into a convex profile to minimize horizontal deviation during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates with curved surface profiles are bonded using existing methods, then bonding can be achieved, but horizontal deviation between substrates increases leading to alignment errors
Solution Approach 1:
Instead of attempting to bond flat substrates directly, the invention inverts the approach by intentionally creating curved surface profiles (concave on one substrate, convex on the other) that will naturally complement each other during bonding. The curved profiles are designed so that when bonded, they achieve mutual tangency, eliminating horizontal deviation and ensuring precise alignment while maintaining bonding reliability.
Solution Approach 2:
The invention changes the surface geometry parameters of the substrates by creating controlled curved profiles with specific radii of curvature. By adjusting the curvature parameters (concave radius R1, convex radius R2) to satisfy the relationship R1 ≈ R2, the system achieves minimal horizontal deviation during bonding, thereby improving alignment precision without compromising bonding reliability.
2Productivity
If chip density is increased to improve device performance, then device performance improves, but horizontal deviation and contact failure risk increase
Solution Approach 1:
The invention addresses the alignment precision challenge posed by high chip density by inverting the surface profiles. The concave and convex curved surfaces are designed to mutually complement each other, ensuring that even with increased chip density, the substrates maintain precise alignment through their curved geometry relationship, thereby preventing contact failures.
Solution Approach 2:
The invention applies preliminary anti-action by pre-configuring the substrates with curved surface profiles that counteract the potential for horizontal deviation. By establishing the concave-convex relationship before bonding, the system proactively prevents alignment errors that would otherwise occur with high chip density, ensuring reliable pad contact.
3Ease of manufacture
If flat substrates are bonded directly, then the bonding process is simple, but horizontal deviation occurs causing alignment errors
Solution Approach 1:
The invention resolves the contradiction between process simplicity and alignment precision by inverting the traditional flat-substrate bonding approach. Instead of bonding flat surfaces directly, the method uses pre-formed curved profiles (concave and convex) that automatically achieve precise alignment through their complementary geometry, maintaining relative process simplicity while dramatically improving alignment precision.
Solution Approach 2:
The invention applies preliminary action by pre-configuring the substrates with curved surface profiles before the bonding process. The concave and convex shapes are formed in advance, so that when the substrates are brought together for bonding, the alignment is automatically achieved through their complementary geometries, eliminating the need for complex real-time alignment adjustments.
Data Source
AI summary
A substrate bonding apparatus and a method of bonding substrates, the apparatus including an upper chuck securing a first substrate onto a lower surface thereof such that the first substrate is downwardly deformed into a concave surface profile; a lower chuck arranged under the upper chuck and securing a second substrate onto an upper surface thereof such that the second substrate is upwardly deformed into a convex surface profile; and a chuck controller controlling the upper chuck and the lower chuck to secure the first substrate and the second substrate, respectively, and generating a shape parameter for changing a shape of the second substrate to the convex surface profile from a flat surface profile.