Substrate Bonding Apparatus With Independent Cylindrical Chucks
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Solution Overview
Problem
Existing substrate bonding technologies face challenges in achieving high accuracy bonding of substrates with complex topography and positional deviations, often resulting in gas bubbles and electrode misalignment due to thermal expansion and anisotropic stress distortion.
Innovation Solution
A substrate bonding apparatus that uses multiple cylindrical members with independent drive and pressure control mechanisms to physically correct substrate distortion, supporting substrates at multiple points and avoiding thermal expansion-induced mismatches, while aligning electrodes with submicron precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thermal expansion method is used for substrate alignment, then bonding process is simplified, but alignment precision deteriorates due to anisotropic stress distortion
Solution Approach 1:
The patent replaces the thermal expansion method with a mechanical positioning system consisting of multiple positioning members (pegs) that physically locate the substrate on the chucking stage. This mechanical positioning system eliminates the anisotropic stress distortion inherent in thermal expansion while achieving submicron alignment precision through precise mechanical fixtures and positioning structures.
2Manufacturing precision
If multiple positioning members are used to correct substrate distortion, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The patent divides the positioning function into multiple independent positioning members (pegs) distributed across the chucking stage. Each positioning member independently corrects local substrate distortion, allowing the system to achieve high overall alignment precision while keeping each individual component simple and manageable.
Solution Approach 2:
The patent employs a control mechanism that independently adjusts the positioning parameters (positions) of multiple positioning members based on detected substrate distortion. By dynamically changing the parameters of each positioning member, the system corrects complex substrate topography and distortion without requiring a fundamentally complex mechanical structure.
3Productivity
If substrates are bonded with complex topography without correction, then processing time is reduced, but bonding quality deteriorates due to gas bubbles and electrode misalignment
Solution Approach 1:
The patent performs preliminary positioning and distortion correction using multiple positioning members before the bonding process begins. The positioning members are adjusted to pre-correct substrate distortion and ensure proper electrode alignment, so that when bonding occurs, the substrates are already in the correct configuration, preventing gas bubbles and misalignment without adding time to the bonding process itself.
Data Source
AI summary
According to one embodiment, in a substrate bonding apparatus a first chucking stage includes a first stage base, a plurality of first cylindrical members, and a plurality of first drive mechanisms. The first stage base includes a first main face facing a second chucking stage. The plurality of first cylindrical members are disposed on the first main face. The plurality of first cylindrical members are arrayed in planar directions. The plurality of first cylindrical members protrudes from the first main face in a direction toward the second chucking stage to chuck the first substrate. The plurality of first drive mechanisms are configured to drive the plurality of first cylindrical members independently of each other. The substrate bonding apparatus further comprises a first pressure control mechanism configured to control pressure states of spaces in the plurality of first cylindrical members independently of each other.