Substrate Bonding Sequence for Distortion-Controlled Layer Stacking
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Solution Overview
Problem
Existing methods of aligning and bonding substrates with formed electric circuits result in increased distortion when multiple substrates are stacked, as distortions from previous bonds are superimposed, leading to misalignment and stress distribution issues.
Innovation Solution
A method and device for bonding substrates that involve releasing the holding of certain substrates during subsequent bondings, allowing for controlled misalignment and stress distribution by thinning specific substrates and adjusting holding release to meet predetermined alignment and stress criteria.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If multiple substrates are bonded in sequence to form a stack, then the stack structure is achieved, but the distortion increases due to superposition of distortions from each bonding step
Solution Approach 1:
The substrate whose holding is released is determined in advance based on distortion distribution information before the bonding process. This preliminary determination allows the system to pre-plan which substrate should have its holding released to minimize distortion superposition, rather than making decisions during the bonding process.
Solution Approach 2:
The system changes the holding state parameter of substrates during bonding. By selectively releasing the holding of one substrate while maintaining the holding of another, the system alters the mechanical constraints on each substrate, allowing controlled distortion management during the bonding process.
2Manufacturing precision
If the holding of substrates is maintained during bonding, then alignment precision is improved, but stress distribution becomes unbalanced leading to increased distortion
Solution Approach 1:
Different holding states are applied to different substrates in the stack. Instead of uniformly maintaining or releasing holding for all substrates, the system selectively releases the holding of one specific substrate while maintaining the holding of others, creating localized differences in mechanical constraints that balance stress distribution.
Solution Approach 2:
The holding state parameter is changed selectively for one substrate during bonding. By transitioning one substrate from a held state to an unheld state while keeping others held, the system adjusts stress distribution locally to prevent distortion superposition while maintaining alignment precision.
Data Source
AI summary
A bonding method including firstly bonding a first substrate to a second substrate by releasing a holding of the first substrate to form a first stack; and secondly bonding one substrate, which has been thinned, among the first substrate and the second substrate that have been bonded, to a third substrate, to form a second stack, wherein when the first substrate is thinned, the holding of the third substrate is released at the second bonding, and when the second substrate is thinned, the holding of the first stack is released at the second bonding.