Substrate Bonding with Dynamic Temperature Control
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving error-free, full-area congruence of substrates during bonding due to positional deviations, thermal deformations, and stress-induced distortions, leading to alignment inaccuracies and 'run-out' errors, which complicate the production of precise multi-substrate stacks.
Innovation Solution
A method involving controlled heating temperature reduction during bonding, release of substrate fixation to allow deformability, and use of radially symmetrical fixing/holding devices to facilitate concentric punctiform contacting, along with ventilation or pressure application to minimize 'run-out' errors, ensuring precise alignment and bonding wave propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If substrates are rigidly fixed during bonding, then alignment stability is improved, but bonding accuracy deteriorates due to thermal deformations and stress-induced distortions
Solution Approach 1:
The patent applies dynamic fixing principles by transitioning from rigid fixed positioning to dynamic release and compensation mechanisms. The substrate fixing is released during bonding to allow thermal deformations and stress-induced distortions to occur naturally, then compensation measures are applied to correct alignment deviations, achieving both stability and precision.
Solution Approach 2:
The patent changes the physical state and constraints of the substrate during the bonding process. By releasing the fixing constraints and allowing the substrate to deform freely under thermal and stress conditions, then applying compensation, the system adapts parameters dynamically to resolve the contradiction between stability and precision.
2Strength
If heating temperature is maintained high during bonding, then bonding strength is improved, but run-out errors increase due to thermal deformations
Solution Approach 1:
The patent applies preliminary action by pre-heating substrates to bonding temperature before the actual bonding process. This allows thermal deformations to occur in advance when alignment is not yet critical, and compensation can be applied before final bonding, thereby reducing run-out errors while maintaining bonding strength.
Solution Approach 2:
The bonding process is divided into periodic stages: pre-heating phase, bonding phase, and compensation phase. During pre-heating, substrates are heated to bonding temperature; during bonding, alignment is finalized; during compensation, alignment deviations are corrected. This periodic approach separates thermal deformation from alignment precision requirements.
3Measurement precision
If alignment is performed before bonding, then initial positioning is improved, but final congruence deteriorates due to substrate deformations during bonding
Solution Approach 1:
The patent implements feedback by measuring alignment deviations after bonding occurs due to thermal and stress deformations, then applying compensation measures to correct these deviations. This feedback loop ensures final congruence accuracy despite initial alignment being performed before bonding.
Solution Approach 2:
Alignment is performed as a preliminary action before bonding, but the patent adds a post-bonding compensation step to correct deformations. This two-stage approach (pre-alignment + post-compensation) ensures both initial positioning and final congruence accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances bonding accuracy, reduces 'run-out' errors, and achieves precise congruence of substrates, improving the overall quality of multi-substrate stacks by allowing for thermodynamic and mechanical compensation mechanisms during the bonding process.
Implementation Method 1
controlled heating temperature reduction during bonding
Implementation Method 2
thermodynamic and mechanical compensation mechanisms during the bonding process
Implementation Method 3
release of substrate fixation to allow deformability
Implementation Method 4
radially symmetrical fixing/holding devices to facilitate concentric punctiform contacting
Implementation Method 5
pressure application to minimize 'run-out' errors
Implementation Method 6
ventilation or pressure application to minimize 'run-out' errors
Data Source
AI summary
A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.