Substrate Bonding Holder Adjustment for Edge Height Alignment
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Solution Overview
Problem
Conventional bonding apparatuses face challenges in maintaining precision during substrate bonding due to height discrepancies at the peripheral portions of substrates caused by pre-bonding processes like chemical mechanical polishing (CMP) or etching, leading to misalignment and reduced bonding accuracy.
Innovation Solution
The bonding apparatus employs a first holder with an outer and inner attraction structure and a transforming mechanism to adjust the height of the peripheral portion of the substrate, using a controller to correct deviations based on acquired height information, ensuring precise alignment and uniform bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pre-bonding processes like CMP or etching are applied to substrates, then substrate surface quality is improved, but height discrepancies at peripheral portions occur leading to misalignment
Solution Approach 1:
The system performs preliminary measurement of substrate height before bonding, and pre-adjusts the holder's attraction structure to compensate for height discrepancies. This preliminary action prevents misalignment during the actual bonding process, resolving the contradiction between surface quality improvement and alignment precision.
Solution Approach 2:
The system uses sensors to detect substrate height at peripheral portions and feeds this information back to the controller, which then adjusts the holder's attraction structure accordingly. This closed-loop feedback mechanism ensures that height discrepancies caused by CMP or etching are compensated, maintaining alignment precision while allowing surface quality improvement.
2Manufacturing precision
If the holder structure is made complex with multiple attraction structures, then bonding precision is improved, but device complexity increases
Solution Approach 1:
The holder's attraction structure is divided into multiple independent zones with different attraction strengths. This segmentation allows selective adjustment of attraction in different areas to compensate for height discrepancies, improving bonding precision without requiring a completely complex redesign of the entire holder structure.
Solution Approach 2:
The holder's attraction structure is made dynamically adjustable, allowing the attraction strength and distribution to be modified in real-time based on measured substrate height. This dynamic capability enables precise bonding compensation while maintaining a relatively simple base structure, resolving the contradiction between precision and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution stabilizes the bonding process by uniformly transforming the outer attraction structure to match the reference points, enhancing precision and maintaining consistent bonding quality across the substrate edges.
Implementation Method 1
a first holder configured to hold a first substrate from below... an outer attraction structure configured to attract a peripheral portion of the first substrate; an inner attraction structure configured to attract a portion of the first substrate inside the peripheral portion
Data Source
AI summary
A bonding apparatus includes a first holder, a pushing member and a controller. The first holder holds a first substrate from below. The second holder is disposed above the first holder and holds a second substrate from above. The pushing member pushes down a central portion of the second substrate. The first holder includes an outer attraction structure, an inner attraction structure and a transforming mechanism. The outer attraction structure attracts a peripheral portion of the first substrate. The inner attraction structure attracts a portion of the first substrate inside the peripheral portion. The transforming mechanism transforms the outer attraction structure relative to the inner attraction structure. The controller acquires information of a height of the peripheral portion from a reference surface and controls the transforming mechanism based on the acquired information.