Device Embedded Substrate Bonding Layer Void Prevention
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Solution Overview
Problem
Existing methods for manufacturing device embedded substrates often result in voids within the bonding layer, which can lead to insulation performance issues, short-circuits, and migration problems, especially when the substrate surface is uneven and active devices with multiple electrodes are used.
Innovation Solution
A manufacturing method involving a bonding layer composed of a first and second bonding body, where the first bonding body is formed along the outer edge of the device and the second bonding body is applied in an area equal to or smaller than the terminal's outer edge, with the first bonding body being cured before the second, ensuring insulation between the conductive pattern and the terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a bonding layer is formed by dispensing or printing method, then the device can be mounted and fixed, but voids are generated inside the bonding layer which may cause separation or short-circuit
Solution Approach 1:
The bonding layer is segmented into two distinct bonding bodies: a first bonding body formed along the outer edge of the device, and a second bonding body formed in an area equal to or smaller than the terminal's outer edge. This segmentation allows the first bonding body to provide structural support and prevent void formation, while the second bonding body provides electrical insulation, thereby resolving the contradiction between ease of manufacture and reliability.
Solution Approach 2:
Different regions of the bonding layer are assigned different functions through the two bonding bodies. The first bonding body (along the outer edge) primarily provides mechanical bonding and void prevention, while the second bonding body (under the terminal) provides electrical insulation. This local differentiation of quality and function ensures both manufacturability and insulation performance.
2Ease of operation
If the surface on which the device comes into contact with the bonding layer is uneven, then device mounting is feasible, but void generation becomes significant affecting connection reliability
Solution Approach 1:
The first bonding body is formed along the outer edge of the device before the second bonding body is applied. This preliminary action creates a structural framework that prevents void formation during subsequent device mounting, even when the substrate surface is uneven. The first bonding body acts as a pre-formed support structure that accommodates surface irregularities.
3Ease of manufacture
If a void is generated between electrodes, then the device can be mounted, but short-circuit or migration may occur between electrode and wiring pattern
Solution Approach 1:
The first bonding body acts as an intermediary structure between the device electrodes and the substrate wiring patterns. By being formed along the outer edge and cured before device mounting, it creates a physical barrier that prevents void-induced short-circuits and migration between electrodes and wiring patterns, while still allowing proper electrical connection through the second bonding body.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method secures insulation performance by interposing the first bonding body between the conductive pattern and the second bonding body, preventing short-circuits and migration, even when voids are generated, and allows for reliable insulation by preventing voids from progressing to subsequent steps.
Implementation Method 1
the first bonding body is cured before the second bonding body is applied
Data Source
AI summary
The present invention provides a manufacturing method of a device embedded substrate, including: forming a bonding layer of an insulation material on a metal layer formed on a support plate; and mounting an electric or electronic device on the bonding layer, wherein the device is formed of a device main body and a protruding terminal; the bonding layer includes a first bonding body bonded with the metal layer and a second bonding body bonded with the device; the first bonding body is formed along the outer edge of the device; the second bonding body is formed in an area equal or smaller than the area defined by the outer edge of the terminal; and, in the bonding layer forming step, the second bonding body is formed on the first bonding body after the first bonding body is cured.