Multi-Layered Substrate Bonding Strength via Segmented Metal Layers
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Solution Overview
Problem
Conventional flexible printed circuit (FPC) substrates with single-layered conductive copper foils experience weak bonding strength when attached to rigid substrates, leading to substrate detachment and poor contact during assembly due to restricted bonding areas by electronic element layouts.
Innovation Solution
A substrate design featuring double- or multi-layered metal layers with distinct electrical and strengthening bonding portions, insulated from each other, increases the bonding area between substrates, enhancing bonding strength through additional bonding regions without affecting layout spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a single-layered conductive copper foil is used in FPC, then the device complexity is reduced, but the bonding strength between substrates becomes too weak to resist pulling force during assembly
Solution Approach 1:
The metal layer is segmented into multiple separate conductive layers (first conductive layer and second conductive layer) that are electrically insulated from each other. This segmentation allows each layer to serve specific bonding functions independently, increasing total bonding area and strength without requiring a single complex large-area conductor.
Solution Approach 2:
The invention transitions from a single-layer (2D) conductive structure to a multi-layer (3D) conductive structure with vertical stacking. The first and second conductive layers are disposed at different heights/positions, creating a three-dimensional bonding configuration that increases bonding area while maintaining compact form factor.
2Strength
If the bonding area is increased to improve bonding strength, then the layout spaces for electronic elements are restricted
Solution Approach 1:
Instead of expanding bonding area horizontally (which would consume layout space), the invention expands bonding area vertically by stacking multiple conductive layers. The first conductive layer bonds to a first bonding portion while the second conductive layer bonds to a second bonding portion, effectively utilizing the vertical dimension to increase bonding area without encroaching on horizontal layout space for electronic elements.
Solution Approach 2:
The bonding function is segmented across multiple layers, with each conductive layer responsible for bonding to specific bonding portions. This allows the bonding areas to be distributed at different locations and heights, increasing total bonding area while maintaining clear separation from electronic element layout areas.
3Strength
If multiple conductive layers are used to increase bonding area, then the electrical insulation requirements between layers increase
Solution Approach 1:
An insulating layer acts as an intermediary between the first conductive layer and the second conductive layer. This insulating layer provides electrical isolation while allowing the two conductive layers to be disposed in close proximity, maintaining compact structure. The insulating layer mediates the electrical interaction between layers, preventing short circuits while enabling the multi-layer bonding configuration.
Data Source
AI summary
A substrate and a substrate bonding device using the same are provided. The substrate includes a base, upper and lower metal layers, and upper and lower covering layers. The base has an upper surface, a lower surface and a through-hole passing there through, wherein the upper and lower covering layers respectively covers the upper and lower metal layers respectively disposed on the upper and lower surfaces of the base. The lower metal layer has an electrical bonding portion and a strengthening bonding portion insulated with each other. The strengthening bonding portion enhances the bonding strength between the substrate and another substrate. The upper metal layer is electrically connected to the electrical bonding portion via the through hole. The lower covering layer exposes the electrical bonding portion and the strengthening bonding portion so as to be respectively connected with two bonding portions of the another substrate.