Substrate Bonding Layer Modulus Control for Void-Free Alignment
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Solution Overview
Problem
In the manufacturing of substrate layered bodies, existing methods face challenges with void generation due to microbumps and particles on semiconductor substrates and misalignment issues during bonding, particularly with direct bonding and adhesive-based methods.
Innovation Solution
A method involving the application of a bonding material to form a cured bonding layer with a reduced modulus of 10 GPa or less, which is then used to bond substrates, ensuring proper alignment and minimizing voids through controlled curing and surface treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If direct bonding is used to bond substrates, then bonding strength is improved, but void generation occurs due to microbumps and particles on substrate surfaces
Solution Approach 1:
The patent introduces a bonding material as an intermediary substance between the first substrate and second substrate. This bonding material fills in surface irregularities such as microbumps and particles, creating a more uniform bonding interface while maintaining strong adhesion to both substrates, thereby reducing void generation while preserving bonding strength.
2Reliability
If adhesive bonding is used to bond substrates, then void generation is reduced, but substrate bonding displacement (misalignment) occurs
Solution Approach 1:
The patent controls the physical and chemical parameters of the bonding material, specifically adjusting its viscosity and curing characteristics. By optimizing these parameters, the bonding material maintains adequate flow properties during application to fill surface defects, then develops sufficient structural integrity to prevent substrate misalignment during the bonding process.
3Ease of manufacture
If adhesive is applied and dried to semi-cured state for bonding, then bonding process is simplified, but substrate bonding displacement (misalignment) tends to occur
Solution Approach 1:
The patent applies the bonding material in a controlled manner before substrate assembly, allowing it to be distributed uniformly across the bonding surface. The material is then cured under controlled conditions to achieve optimal mechanical properties before final substrate bonding, preventing misalignment while maintaining process simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses void generation and misalignment, resulting in a robust and reliable substrate layered body with improved bonding strength and reduced defects.
Implementation Method 1
a step of curing the bonding material applied to the surface, to form a bonding layer having a reduced modulus at 23° C. of 10 GPa or less
Implementation Method 2
in the step of forming the bonding layer, the bonding material applied to the surface is heated at from 100° C. to 450° C. for curing
Implementation Method 3
form a bonding layer having a reduced modulus at 23° C. of 10 GPa or less
Implementation Method 4
a step of forming a hydroxyl group by performing a surface treatment on a surface of at least one of the first substrate or the second substrate
Implementation Method 5
forming a hydroxyl group by performing a surface treatment
Data Source
AI summary
A method of manufacturing a substrate layered body includes: a step of applying a bonding material to the surface of at least one of a first substrate or a second substrate; a step of curing the bonding material applied on the surface to form a bonding layer having a reduced modulus at 23° C. of 10 GPa or less; and a step of bonding the first substrate and the second substrate via the bonding layer formed.