Substrate Bonding Pin Pressure Control via Electric Actuator
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Solution Overview
Problem
Existing substrate bonding methods face challenges in precisely controlling the pressure, speed, and distance of a bonding pin, leading to inconsistent bonding quality and reproducibility.
Innovation Solution
A substrate bonding apparatus comprising a lower chuck, an upper chuck, an electric actuator, pressure sensors, and a controller, which allows for precise control of the bonding pin's pressure, speed, and distance through real-time pressure sensing and adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a pneumatic bonding apparatus is used, then substrate bonding can be performed, but it is difficult to precisely control the lowering pressure, speed, and distance of the bonding pin
Solution Approach 1:
The patent replaces the pneumatic bonding apparatus with an electric actuator that directly drives the bonding pin. This substitution enables precise control of the bonding pin's lowering pressure, speed, and distance through electrical signals, eliminating the control limitations of pneumatic systems while maintaining the bonding function.
Solution Approach 2:
The patent incorporates pressure sensors that provide real-time feedback on the bonding pin's lowering pressure. The controller uses this feedback information to dynamically adjust and maintain precise control over the bonding process, ensuring uniform bonding quality across substrates.
2Reliability
If conventional bonding methods are used, then substrate bonding can be performed, but it is difficult to ensure reproducibility of substrate bonding
Solution Approach 1:
The pressure sensors provide real-time feedback on the actual bonding conditions, allowing the controller to detect and correct deviations from the intended bonding parameters. This closed-loop control ensures that each bonding operation reproduces the same high-quality results, improving both reliability and consistency.
Solution Approach 2:
By replacing the pneumatic system with an electric actuator, the patent achieves more precise and repeatable control over bonding parameters such as pressure, speed, and distance. This substitution enables better reproducibility of bonding conditions across multiple operations while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures precise control over the bonding process, enhancing the reproducibility and quality of substrate bonding by adjusting the pressure and speed of the bonding pin in real-time.
Implementation Method 1
a pressure sensor, which is below an upper surface of the lower chuck and is configured to be below the lower substrate supported on the upper surface of the lower chuck, to sense a pressure applied when the lower substrate and the upper substrate are bonded, in real time
Data Source
AI summary
A substrate bonding apparatus includes a lower chuck, an upper chuck, an electric actuator on a central portion of the upper chuck, a pressure sensor, and a controller. The lower chuck may support a lower substrate, the upper chuck may face the lower chuck such that a lower surface of the upper chuck faces the upper surface of the lower chuck, and the upper chuck may support an upper substrate. The electric actuator may lower a bonding pin through the upper chuck to apply a pressure to the upper substrate supported on the upper chuck. The pressure sensor may be below the lower substrate supported on the lower chuck. The pressure sensor may sense a lowering pressure applied by the bonding pin to the pressure sensor in real time. The controller may control the lowering pressure applied by the bonding pin.