Substrate Bonding via Oxygen Plasma and Nitrogen Radical Irradiation
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Solution Overview
Problem
Conventional substrate bonding techniques, such as plasma assist bonding, fail to effectively enhance the strength of bonding by irradiating multiple types of particle beams, and lack a simple method to perform both plasma and radical radiation using a single device.
Innovation Solution
A method and apparatus that irradiate substrates with an oxygen plasma and a nitrogen radical simultaneously or subsequently, using a single device, to enhance bonding strength by generating plasmas and radicals through controlled high-frequency voltage applications, allowing for strong substrate bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional plasma assist bonding is used to bond substrates, then the bonding process can be completed, but the bonding strength is not sufficiently enhanced
Solution Approach 1:
The invention combines multiple particle beam irradiation functions (oxygen plasma and nitrogen radical) into a single irradiation device. The apparatus integrates a first irradiation unit for oxygen plasma and a second irradiation unit for nitrogen radical, allowing both types of irradiation to be performed on substrates within one device, thereby enhancing bonding strength while maintaining device simplicity
Solution Approach 2:
The irradiation device is designed with multi-functionality to perform both oxygen plasma irradiation and nitrogen radical irradiation. By incorporating multiple irradiation units with different gas supply systems (oxygen gas supply unit and nitrogen gas supply unit), the device can selectively apply different particle beams to enhance substrate bonding strength beyond what conventional single-function devices achieve
2Strength
If multiple types of particle beams are used to irradiate substrates, then bonding strength can be enhanced, but the device complexity increases
Solution Approach 1:
The invention merges multiple irradiation functions into a single integrated device structure. The first irradiation unit and second irradiation unit are combined within one apparatus, sharing common components such as the chamber, power supply system, and control mechanisms, thereby reducing overall device complexity while still providing enhanced bonding strength through multiple particle beam types
Solution Approach 2:
The device achieves multi-functionality through a unified platform that can switch between different gas supply modes (oxygen or nitrogen) to produce different particle beams. This universal design allows the same basic device structure to perform multiple irradiation functions without requiring separate complex systems for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves strong substrate bonding by combining oxygen plasma and nitrogen radical irradiation, resulting in enhanced tensile strength and efficient bonding process using a single device, surpassing conventional techniques in bonding strength and simplicity.
Implementation Method 1
the irradiation of the substrate with the plasma is effected by grounding the first electrode while applying a high-frequency voltage to the substrate thereby inducing generation of a first plasma in a space between the first electrode and the substrate
Implementation Method 2
the irradiation of the substrate with the radical is effected by grounding the first electrode while applying a high-frequency voltage to the second electrode thereby inducing generation of a second plasma in a space between the first electrode and the second electrode
Implementation Method 3
enabling the radical to be passed through the opening in the first electrode
Data Source
AI summary
A substrate bonding method for mutually bonding substrates, has a first radiation step for irradiating the surfaces of the individual substrates with an oxygen particle beam, a second radiation step for irradiating the surfaces of the individual substrate with a nitrogen particle beam simultaneously with or subsequently to the first radiation step, and a step for stacking the individual substrates and bringing the surfaces thereof into close contact. Particularly, the substrates which have been irradiated first with an oxygen plasma and subsequently with a nitrogen plasma are stacked and bonded.