Substrate Bonding Pressing Member Marking Structure
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Solution Overview
Problem
Existing substrate bonding apparatuses face challenges in ensuring proper bonding of substrates due to deviations in the central part, likely caused by improper pressing with a pressing member, which makes it difficult to confirm the pressing position and force applied.
Innovation Solution
A substrate bonding apparatus is designed with a pressing member featuring a marking structure on its distal end, which deforms the substrate to be convex and applies a marking pattern, allowing for the measurement of the pressing position and orientation after bonding, thereby confirming the actual pressing position and force applied.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a pressing member is used to press substrates during bonding, then bonding force is applied to join substrates, but pressing position deviation occurs causing central part defects
Solution Approach 1:
The patent implements a feedback mechanism by capturing images of the substrate before and after pressing, comparing the positions of alignment marks, and calculating actual pressing position deviations. This feedback information is then used to correct pressing parameters or compensate for deviations in subsequent operations, resolving the contradiction between applying sufficient bonding force and maintaining pressing position precision.
Solution Approach 2:
The patent replaces direct mechanical measurement of pressing position with an optical measurement system using imaging devices and image processing. Instead of relying solely on mechanical positioning systems, the invention uses visual detection of alignment marks to determine actual pressing positions, substituting mechanical measurement with optical-field measurement to achieve higher precision.
2Reliability
If pressing force is increased to ensure proper bonding, then bonding reliability improves, but substrate deformation increases causing convexity issues
Solution Approach 1:
The patent applies dynamic control to the pressing process by using imaging feedback to monitor substrate deformation in real-time and adjusting pressing parameters accordingly. The system transitions from static, fixed pressing parameters to dynamic, adaptive pressing control that responds to actual substrate conditions, allowing reliable bonding while maintaining shape uniformity through real-time adjustments.
Solution Approach 2:
The patent changes pressing parameters (force, duration, position) based on feedback from image analysis of substrate deformation and alignment mark positions. By dynamically adjusting these parameters rather than using fixed values, the system achieves reliable bonding while compensating for substrate-specific variations that would otherwise cause deformation or convexity issues.
3Device complexity
If pressing member position is not monitored, then device complexity is reduced, but pressing position accuracy cannot be confirmed
Solution Approach 1:
The patent introduces alignment marks as intermediary elements that facilitate pressing position measurement. These marks serve as mediators between the pressing member and the imaging system, enabling accurate position detection without requiring complex direct measurement instruments. The alignment marks provide reference points that simplify the measurement process while maintaining high precision.
Solution Approach 2:
The patent creates an optical copy (image) of the substrate and alignment marks before and after pressing, then analyzes this copied information to determine pressing position accuracy. By working with image copies rather than directly measuring physical positions during pressing, the system achieves high measurement precision while keeping the monitoring system relatively simple and non-intrusive.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables accurate confirmation of the pressing position and orientation of the pressing member, ensuring proper bonding of substrates by measuring the marking pattern formed on the substrate's back surface, thus addressing the deviation issues.
Implementation Method 1
a first suction stage that sucks a first substrate
Implementation Method 2
a second suction stage that is arranged so as to face the first substrate and sucks a second substrate
Implementation Method 3
The pressing member has a marking structure on a distal end side
Data Source
AI summary
According to one embodiment, there is provided a substrate bonding apparatus including a first suction stage, a second suction stage, and a pressing member. The first suction stage sucks a first substrate. The second suction stage is arranged so as to face the first substrate. The second suction stage sucks the second substrate. The pressing member is capable of deforming the first substrate sucked on the first suction stage so as to be convex toward the second suction stage side. The pressing member has a marking structure on a distal end side.