Substrate Bonding Pressure Switching to Minimize Distortion
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Solution Overview
Problem
Existing bonding apparatuses face challenges in achieving high precision and minimizing distortion during the bonding process of substrates due to uneven attracting pressure distributions, which can lead to inaccuracies and defects in the bonded substrates.
Innovation Solution
A bonding apparatus with a controller that adjusts the attracting pressure distribution on the substrate holders from a beginning distribution to a progress distribution during the bonding process, ensuring uniform pressure across all regions as the bonding progresses, thereby maintaining precise contact and minimizing distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a fixed attracting pressure distribution is applied to the substrate holder, then the substrate can be held stably, but distortion occurs during bonding due to uneven pressure distribution
Solution Approach 1:
The attracting pressure distribution is changed dynamically during the bonding process. The controller switches from a first attracting pressure distribution (with higher pressure at the center) to a second attracting pressure distribution (with higher pressure at the periphery) as bonding progresses, allowing the system to adapt to different bonding stages and minimize distortion
Solution Approach 2:
The attracting pressure parameters are changed during the bonding process. The controller adjusts the pressure distribution pattern from center-weighted to periphery-weighted by changing the vacuum suction strength in different regions of the substrate holder, optimizing the pressure distribution at each bonding stage
2Strength
If the attracting pressure is increased to fix the substrate firmly, then substrate holding is improved, but bonding distortion increases due to non-uniform pressure
Solution Approach 1:
Different regions of the substrate holder apply different attracting pressure strengths. The holder has multiple regions with independently controllable vacuum suction, allowing the center region to apply stronger pressure for initial bonding while periphery regions apply appropriate pressure to prevent distortion
Solution Approach 2:
The attracting pressure distribution is dynamically adjusted during bonding. The controller switches between different pressure distribution patterns (first with center emphasis, second with periphery emphasis) to optimize both holding strength and bonding accuracy at different stages
3Productivity
If the bonding process is accelerated by increasing pressure, then productivity is improved, but distortion and bonding defects increase
Solution Approach 1:
The bonding process is divided into distinct stages with different pressure distributions. The controller implements periodic switching between the first attracting pressure distribution (for initial contact) and the second attracting pressure distribution (for complete bonding), ensuring quality at each stage while maintaining overall efficiency
Solution Approach 2:
The first attracting pressure distribution is applied in advance during the initial bonding stage to ensure proper contact between substrates before switching to the second distribution pattern, preventing distortion from the outset
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-precision bonding of substrates by uniformly fixing the substrates from center to periphery, reducing distortion and ensuring stable bonding across the entire surface, thus improving the quality and accuracy of the bonded substrates.
Implementation Method 1
a second holder, allowed to be disposed at a position facing the first holder, having an attraction surface partitioned into multiple regions configured to attract a second substrate
Implementation Method 2
bonds the centers of the two substrates to each other by an intermolecular force
Data Source
AI summary
A bonding apparatus includes a first holder, a second holder, an attracting pressure generator, a pushing member and a controller. The controller attracts a second substrate with a beginning attracting pressure distribution set on multiple regions, when a pressurization of a first substrate by the pushing member is begun. The controller performs a control of performing a switchover from the beginning attracting pressure distribution to a progress attracting pressure distribution between a time point when the pressurization by the pushing member is begun and a contact end point at which an entire bonding surface of the first substrate and an entire bonding surface of the second substrate come into contact with each other. The progress attracting pressure distribution is created by changing at least one attracting pressure of attracting pressures on the multiple regions in the beginning attracting pressure distribution.