Substrate Bonding Plate Bending to Minimize Run-Out Errors
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Solution Overview
Problem
The alignment precision of functional units between substrates during bonding processes is compromised by distortions, leading to 'run-out' errors that increase radially from the contact point to the substrate circumference, affecting overlay precision and subsequent process steps.
Innovation Solution
A method and device involving a plate between the substrate and chuck, which is bent to minimize 'run-out' errors by increasing bending resistance, using a bending mechanism with compressed air or vacuum to maintain substrate alignment and support during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates are bonded using conventional chucks without plates, then the bonding process is simple, but run-out errors increase radially from the contact point to the substrate circumference, compromising alignment precision
Solution Approach 1:
A plate is introduced as an intermediary element between the substrate and the chuck. This plate serves as a mediator that transmits forces uniformly across the substrate, preventing radial distortion and run-out errors while maintaining the simplicity of the overall bonding process.
Solution Approach 2:
The bonding system is segmented into distinct functional components: the chuck, the plate, and the substrate. This segmentation allows each component to perform its specific function optimally - the chuck provides holding force, the plate distributes this force uniformly, and the substrate maintains its alignment, thereby reducing run-out errors.
2Manufacturing precision
If a plate is introduced between the substrate and chuck to reduce run-out errors, then alignment precision improves to less than 50 nm, but the device complexity increases
Solution Approach 1:
The plate acts as an intermediary that simplifies the interaction between the chuck and substrate by providing a uniform force distribution interface, thereby improving overlay precision to less than 50 nm while adding minimal complexity to the system.
Solution Approach 2:
The plate changes the mechanical parameters of the bonding interface by providing uniform force distribution and preventing radial distortion, which directly improves overlay precision while the plate's simple geometry keeps the added complexity minimal.
3Adaptability or versatility
If the lower substrate is not fixed during bonding to allow free bonding, then bonding flexibility increases, but alignment precision deteriorates due to lack of boundary conditions
Solution Approach 1:
The plate serves as an intermediary that provides necessary boundary conditions to the substrate during bonding. By coupling the substrate to the chuck through the plate, the system maintains both bonding flexibility and alignment precision, as the plate transmits forces uniformly while allowing the bonding process to proceed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly reduces 'run-out' errors to less than 100 nm, enhancing overall overlay precision to less than 50 nm, allowing precise alignment and contact across the entire substrate surface.
Implementation Method 1
using a bending mechanism with compressed air or vacuum to maintain substrate alignment and support during bonding
Implementation Method 2
using a bending mechanism with compressed air or vacuum to maintain substrate alignment and support during bonding
Data Source
AI summary
A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.