Substrate Bonding with Bendable Plate for Run-Out Control
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Solution Overview
Problem
Existing substrate bonding processes in the semiconductor industry face challenges with alignment precision due to distortions during bonding, leading to 'run-out' errors that affect the overlay precision of functional units, which are exacerbated radially from the contact point to the substrate circumference.
Innovation Solution
A method and device involving a plate between the substrate and chuck, which is bent to minimize 'run-out' errors by increasing bending resistance, allowing for whole-surface contacting and precise alignment through controlled deformation mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates are bonded directly on a planar chuck surface, then the bonding process is simple, but alignment precision deteriorates due to substrate distortions causing run-out errors
Solution Approach 1:
A plate is introduced as an intermediary component between the substrate and the chuck. This plate can be bent to compensate for substrate distortions during bonding, thereby maintaining alignment precision without requiring direct modification of the substrate-chuck interface. The plate acts as a mediator that absorbs and corrects run-out errors radially from the contact point.
Solution Approach 2:
The plate is designed to be bendable rather than rigid, allowing it to dynamically adjust its shape during the bonding process. This dynamic capability enables the plate to compensate for substrate distortions and maintain planarity at the bonding interface, thereby preserving alignment precision throughout the bonding operation.
2Manufacturing precision
If the lower substrate is not fixed during bonding, then run-out errors are reduced, but alignment precision deteriorates due to lack of boundary conditions
Solution Approach 1:
The fixing arrangement provides localized boundary conditions at specific regions of the substrate rather than uniform fixation across the entire substrate. This local quality approach allows the substrate to maintain stability where needed while still permitting controlled deformation in other regions, thereby reducing run-out errors without compromising overall alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly reduces 'run-out', translational, rotational, and residual errors, achieving overlay precision below 50 nm, enabling precise bonding and subsequent process alignment.
Implementation Method 1
a plate between the substrate and chuck, which is bent to minimize 'run-out' errors by increasing bending resistance
Implementation Method 2
substrates have been connected to one another in the semiconductor industry by means of what are known as bonding processes
Data Source
AI summary
A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.