Substrate Bonding Device with Segmented Vacuum Fixation
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Solution Overview
Problem
In the semiconductor industry, achieving precise and contamination-free bonding of substrates with high alignment accuracy is challenging due to the difficulty in reliable and gentle detachment of wafers from receiving devices, especially with thin and double-sided polished wafers, and the need for exact adjustment accuracy below 250nm.
Innovation Solution
A device and method for bonding substrates using a receiving device with controllable deformation means to apply prestress radially to the substrate, reducing the effective receiving area and allowing for controlled bonding and detachment, while maintaining precise alignment and minimizing distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum fixation is applied between the wafer and receiving device, then reliable support and fixation are achieved, but detachment becomes increasingly difficult with thin and double-sided polished wafers
Solution Approach 1:
The receiving surface is divided into a fixation area (outer ring section) and a release area (inner region), allowing selective detachment. The fixation means act only on the outer ring section while the inner region remains free for gentle release, resolving the contradiction between reliable fixation and easy detachment.
Solution Approach 2:
Different regions of the receiving surface have different properties: the outer ring section has fixation capability through vacuum or electrostatic charging, while the inner region has release capability. This local differentiation allows simultaneous achievement of reliable fixation and gentle detachment.
2Ease of operation
If the contact surface area is reduced to enable gentle detachment, then detachment ease improves, but alignment precision and bonding quality deteriorate
Solution Approach 1:
The receiving surface is segmented into fixation area and release area. The fixation area provides sufficient contact for precise alignment during bonding, while the release area enables gentle detachment, resolving the contradiction between alignment precision and detachment ease.
Solution Approach 2:
Alignment and bonding are performed first on the fixation area, ensuring precise positioning. Detachment is then performed selectively from the release area, maintaining both alignment precision and gentle release.
3Manufacturing precision
If alignment accuracy is increased to below 250nm, then bonding quality improves, but the complexity of controlling influencing factors increases
Solution Approach 1:
The receiving surface is differentiated into fixation area for precise alignment and release area for gentle detachment. This local quality differentiation simplifies control by separating the alignment function from the detachment function, reducing the complexity of controlling multiple influencing factors simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables gentle and reliable detachment of wafers with minimal force and distortion, achieving high alignment accuracy and minimizing contamination, with the ability to maintain precise bonding across the substrate surface.
Implementation Method 1
The fixation takes place, for example, by applying a vacuum between the wafer and the receiving device
Implementation Method 2
at least one of the substrates is subjected to a prestress that runs radially outwards, in particular concentrically to the center M of a contact surface of the substrate
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3a~3b
AI summary
The present invention relates to a device for bonding a first substrate (15) to a second substrate, comprising: - a receiving device for receiving the first substrate (15) on a receiving contour (8, 8', 8", 8"', 8IV) with an effective receiving surface (7, 7', 7", 7"', 7IV) of the receiving device with an outer ring section (10) for controllable fixation of the first substrate (15), - deformation means for controllable deformation of the first substrate (15), wherein the deformation means are designed to act within the outer ring section, and - bonding means for bonding the first substrate (15) to the second substrate ().The invention further relates to a method for bonding a first substrate (15) to a second substrate comprising the following steps, in particular the following sequence: - receiving the first substrate (15) on a receiving contour (8, 8', 8", 8"') with an effective receiving surface (7, 7', 7", 7"', 7IV) of the receiving device (1) with an outer ring section (10) for controllable fixation of the first substrate (15), - deformation of the first substrate (15) within the outer ring section by means of deformation means for controllable deformation of the first substrate (15), - bonding of the first substrate (15) to the second substrate by means of bonding means.