Light-Emitting Substrate Bonding With Sloped Connecting Parts
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Solution Overview
Problem
The low bonding yield rate of mini light-emitting diodes on glass substrates is a significant challenge in display technology, necessitating an improvement in the manufacturing method to enhance the accuracy and reliability of light-emitting element bonding.
Innovation Solution
A manufacturing method involving the formation of a patterned photoresist layer with electroplating photoresist, creating openings that expose electrodes, and forming connecting parts with controlled slope angles between 40° and 140°, which allows for the precise bonding of light-emitting elements, reducing the risk of short circuits and improving yield rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If connecting parts are formed by stencil printing, then the manufacturing process is simple, but the accuracy of connecting parts on electrodes is poor and slope angles are small causing short circuits
Solution Approach 1:
The patent applies preliminary action by forming a patterned photoresist layer with openings that precisely define the position and shape of connecting parts before the actual connecting part formation. This pre-defined template ensures high positioning accuracy and controls slope angles to prevent short circuits, resolving the contradiction between precision and process complexity.
Solution Approach 2:
The patterned photoresist layer serves as an intermediary tool that enables precise formation of connecting parts. It acts as a mask and template during the forming process, allowing accurate positioning and slope angle control without requiring complex direct printing methods, thus improving precision while managing process complexity.
2Length of moving object
If the distance between light-emitting elements is reduced, then the display resolution is improved, but the bonding yield rate decreases
Solution Approach 1:
The patterned photoresist layer is formed in advance with openings that precisely define connecting part positions, ensuring accurate bonding even when elements are closely spaced. This preliminary structuring maintains bonding yield rate while enabling reduced element pitch for higher display resolution.
Solution Approach 2:
The patent controls the filling thickness of connecting parts to be less than or equal to the photoresist layer thickness, creating a self-limiting filling process that prevents overflow and short circuits. This controlled filling mechanism enables reliable bonding at reduced element distances by preventing material spread that would cause failures.
3Reliability
If slope angles of connecting part sidewalls are small, then the manufacturing process is easier, but the risk of contact between adjacent connecting parts increases causing short circuits
Solution Approach 1:
The patterned photoresist layer is formed beforehand with controlled opening geometry that defines the slope angles of connecting parts. This preliminary structuring ensures slope angles are maintained within the optimal 40°-140° range, preventing adjacent connecting part contact and short circuits while using a standard photoresist process that remains easy to manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures accurate and reliable bonding of light-emitting elements, reduces the risk of short circuits, and facilitates large-scale production with lower costs, thereby enhancing the display device's performance and efficiency.
Implementation Method 1
forming a patterned photoresist layer on a surface of the substrate provided with the electrodes, the patterned photoresist layer including a plurality of openings overlapping with the electrodes
Implementation Method 2
forming a plurality of connecting parts in the openings; wherein slope angles of a plurality of connecting part sidewalls of the connecting parts are ranged between 40° and 140°
Data Source
AI summary
A manufacturing method of a light-emitting substrate and a display device are provided. The manufacturing method includes: providing a substrate provided with a plurality of electrodes, forming a patterned photoresist layer including openings exposing the electrodes on a surface of the substrate, forming connecting parts in the openings, removing the patterned photoresist layer, and bonding a plurality of light-emitting elements on the connecting parts, wherein slope angles of a plurality of connecting part sidewalls of the connecting parts are ranged between 40° and 140°. The method could improve a yield rate of light-emitting elements bonded to electrodes through connecting parts.