Substrate Assembly Bonding with VUV-Modified Regions and Intermediary Layer
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Solution Overview
Problem
Conventional substrate bonding methods using cyclo-olefin polymer substrates are prone to separation due to external forces and moisture ingress, leading to weakened interactions between hydrophilic functional groups modified by VUV radiation.
Innovation Solution
A substrate assembly and bonding method involving surface-modified regions on substrates, where a bonding member is introduced within a defined space between the substrates, utilizing plasma or light irradiation to create hydrophilic functional groups, and an adhesive to enhance bonding strength and prevent moisture entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If VUV light is used to modify substrate surfaces to create hydrophilic functional groups for bonding, then bonding capability is improved, but the bonded substrates become susceptible to separation under external force and moisture ingress
Solution Approach 1:
A bonding member comprising a curing agent and a polymerizable compound is introduced as an intermediary between the two VUV-modified substrates. The bonding member fills the interface region and forms a network structure through polymerization, mediating the connection between substrates and preventing direct exposure of the VUV-modified surfaces to moisture and external forces, thereby resolving the contradiction between achieving strong bonding and maintaining long-term stability
Solution Approach 2:
The bonding member forms a composite structure combining the curing agent and polymerizable compound in a specific ratio (0.5:99.5 to 50:50 by weight). This composite material provides both strong adhesion to the VUV-modified substrates and resistance to moisture and external forces, resolving the contradiction by creating a multi-functional bonding layer that simultaneously achieves strong bonding and high reliability
2Ease of manufacture
If VUV-modified surfaces are bonded together through hydrophilic functional group interaction, then initial bonding is achieved, but moisture enters the interface and weakens the bond over time
Solution Approach 1:
The bonding member serves as an intermediary layer that fills the interface between substrates, creating a barrier that prevents moisture from reaching the VUV-modified surfaces. This mediator maintains the simplicity of the bonding process while effectively blocking the harmful effect of moisture ingress
Solution Approach 2:
The bonding member forms a thin film structure at the substrate interface that acts as a protective barrier against moisture. This thin film maintains close contact with the substrates while providing effective moisture blocking, resolving the contradiction between manufacturing simplicity and moisture resistance
3Reliability
If a bonding member is introduced to enhance bonding strength and prevent separation, then bond stability is improved, but device complexity increases
Solution Approach 1:
The bonding interface is segmented into multiple functional components: the VUV-modified substrate surfaces and the bonding member with specific functional groups. This segmentation allows each component to perform its specific function (adhesion, cross-linking, moisture barrier) while maintaining overall structural simplicity and reliability
Solution Approach 2:
The bonding member's properties are optimized by controlling the ratio of curing agent to polymerizable compound (0.5:99.5 to 50:50 by weight) and selecting specific functional groups. This parameter optimization achieves high bond stability with minimal structural complexity, as the chemical composition is tuned rather than adding complex structural elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides a stable bond resistant to external forces and moisture, maintaining bonding strength even under ultrasonic oscillation and heating treatments, thus extending the service life of the substrate assembly.
Implementation Method 1
applying vacuum ultraviolet (VUV) light to a surface of each of the substrates 11 to form a VUV-modified surface 111 on each of the two substrates 11; the hydrophobic surfaces of the substrates 11 are modified using VUV radiation to have hydrophilic functional groups
Implementation Method 2
subjecting a first connecting surface of the first substrate and a second connecting surface of the second substrate to a surface-modifying treatment using an energy source, so as to form a first surface-modified region on the first connecting surface and a second surface-modified region on the second connecting surface, the energy source being selected from the group consisting of a plasma, a light irradiation
Data Source
AI summary
A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.