Semiconductor Substrate Bonding Alignment Under Warpage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Substrates in semiconductor devices may not be appropriately bonded due to warpage, leading to manufacturing challenges.
Innovation Solution
A method of manufacturing semiconductor devices that involves forming metal pads on substrates and correcting their positions to align with each other, including translational, rotational, and enlargement/correction techniques to compensate for warpage and positional deviations during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are bonded together directly without correction, then the bonding process is simple and fast, but the substrates cannot be bonded appropriately due to warpage
Solution Approach 1:
The patent applies preliminary action by measuring warpage before bonding and calculating corrected positions in advance. The correction amount calculation unit computes the necessary position adjustments based on pre-measured warpage data, allowing the bonding process to proceed with pre-determined correction values, thus resolving the contradiction between bonding reliability and process complexity.
Solution Approach 2:
The patent implements feedback by using measured warpage information to adjust the bonding positions. The warpage measurement unit provides feedback data to the correction amount calculation unit, which then determines appropriate position corrections, ensuring reliable bonding while managing process complexity through systematic feedback control.
2Manufacturing precision
If position correction is applied to compensate for warpage, then bonding alignment is improved, but measurement and positioning difficulty increases
Solution Approach 1:
The patent replaces complex mechanical measurement and adjustment systems with computational methods. Instead of using sophisticated mechanical positioning devices to achieve alignment, the system uses warpage measurement data and computational algorithms to calculate correction amounts, substituting mechanical complexity with mathematical processing to achieve high alignment precision.
Solution Approach 2:
The patent applies parameter changes by transforming physical warpage measurements into corrected position parameters. The system measures warpage as a physical parameter, then converts this into correction amount parameters that adjust the bonding positions, enabling precise alignment through parameter transformation rather than direct physical measurement of final positions.
Data Source
AI summary
A method of manufacturing a semiconductor device includes forming a first metal pad in each of a plurality of first regions on a first substrate so that warpage is generated on the first substrate. The method further includes forming a second metal pad in each of a plurality of second regions on a second substrate via a predetermined pattern. The method further includes bonding, after forming the first metal pad and the second metal pad, the first substrate with the second substrate. Moreover, the method further includes: making a correction, at a time of forming the predetermined pattern in each of the plurality of second regions on the second substrate, to change a position of the predetermined pattern in each of the plurality of second regions in a direction of being closer to a center of the second substrate for a first direction and to change the position of the predetermined pattern in a direction of being farther from the center of the second substrate for a second direction.