Multi-Layer Substrate with Bosses for Power Converter Thermal Management
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Solution Overview
Problem
Current power converter systems face challenges in optimizing heat transfer and reducing parasitic inductance while managing high development costs and thermal resistance, particularly in applications requiring low recurring costs and efficient heat conduction, such as in aeronautical uses.
Innovation Solution
A substrate for power components is designed with a stack of conductive and insulating layers, where conductive layers have bosses for embedding power components or creating heat sinks, and insulating layers provide mechanical association and electrical insulation, allowing for efficient heat dissipation and reduced parasitic inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a standard power module with base and substrate is used, then thermal management is improved, but thermal resistance increases due to multiple thermal interfaces
Solution Approach 1:
The invention extracts and eliminates the base component from the traditional power module structure. The substrate is designed to directly contact the cooling system without an intermediate base, removing the thermal interface between base and substrate and reducing overall thermal resistance while maintaining thermal management functionality.
Solution Approach 2:
The substrate is segmented into multiple conductive layers (first conductive layer, second conductive layer, third conductive layer) separated by insulating layers. This segmentation allows each layer to serve specific functions: power component mounting, electrical insulation, and heat conduction, optimizing both thermal performance and electrical isolation.
2Adaptability or versatility
If discrete components on printed circuit are used, then adaptability is improved, but parasitic inductance increases and heat transfer is reduced
Solution Approach 1:
The invention merges the substrate with the cooling system by designing the substrate to directly contact the cooling system. This integration eliminates intermediate thermal interfaces and reduces parasitic inductance by shortening current paths, while the modular substrate design maintains adaptability for different power component configurations.
Solution Approach 2:
The substrate employs composite material construction with multiple conductive layers (copper or aluminum) separated by insulating layers. This composite structure provides both low parasitic inductance through highly conductive materials and appropriate electrical insulation, while maintaining flexibility for various applications.
3Reliability
If custom substrate development is done for each application, then performance optimization is improved, but development cost increases
Solution Approach 1:
The substrate is designed as a universal platform with standardized multi-layer construction that can accommodate different power component configurations and cooling system types. The modular design with conductive and insulating layers provides a flexible framework that can be adapted to various applications without requiring complete custom development, reducing development costs while maintaining performance optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces thermal resistance and parasitic inductance, enabling efficient heat transfer and electrical performance in a compact form, suitable for various power levels and applications, including aeronautical uses, while minimizing development costs.
Implementation Method 1
The cooling system allows discharging the calories dissipated by the electronics either into the air or through an exchange with a coolant
Implementation Method 2
The cooling system allows discharging the calories dissipated by the electronics either into the air or through an exchange with a coolant
Implementation Method 3
a substrate for power components formed by the superimposition of two to N layers, or plates, of an electrically and thermally conductive material
Implementation Method 4
a power converter consisting mainly of power switches controlled according to predefined control laws
Data Source
AI summary
An electric circuit for a power converter having a substrate having a first face on which electronic components are mounted and a second face intended to cooperate with a cooling system, the substrate having a stack of conductive layers made of electrically and thermally conductive material and at least one insulating layer made of electrically insulating material, two successive conductive layers being separated by an insulating layer, and the conductive and insulating layers extending in parallel planes and being mechanically associated together. Each conductive layer has two opposite faces parallel to the plane in which the first face of the substrate extends and includes, on at least one of its two faces, at least one boss extending in a direction perpendicular to the plane, the at least one boss passing through at least one other conductive layer and opening out onto the first or the second face of the substrate.