Substrate-Bottom Electrical Connector for Low-Profile High-Speed Links

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Solution Overview

Problem

Existing electrical connectors using printed circuit boards (PCBs) face challenges in achieving low-profile and high-speed performance, as they often require complex stamped contact structures that hinder compact design and efficient signal transmission.

Innovation Solution

The use of a substrate with conductive pads and wirings replaces traditional stamped contacts, integrating the substrate as a bottom wall of the insulative housing, enabling a low-profile and high-speed electrical connector assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If traditional stamped contact structures are used in electrical connectors with PCBs, then the connector can achieve basic electrical connection functionality, but the structure becomes complex and the profile height increases

Engineering Contradiction:
Improvecontact structure complexityVSAvoidconnector profile height
Core Design Contradiction:
Device complexityVSLength of moving object

Solution Approach 1:

The patent merges the substrate and bottom wall into a single integrated component. The substrate is secured to the insulative housing to constitute the bottom wall, eliminating the need for separate stamped contact structures and reducing overall complexity while maintaining low profile height

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate serves multiple functions simultaneously: it provides the bottom wall structure, contains the conductive contacts for electrical connection, and integrates the wiring pathways. This multi-functionality replaces what would traditionally require multiple separate components including stamped contacts

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If traditional stamped contact structures are used, then the connector can provide basic signal transmission, but signal transmission efficiency is reduced

Engineering Contradiction:
Improvesignal transmission efficiencyVSAvoidcontact structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical stamped contact structure with an integrated substrate-based contact system. The conductive pads on the substrate provide direct electrical connection without requiring mechanical stamped contacts, improving signal transmission efficiency by eliminating additional mechanical interfaces

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Length of moving object

If a substrate is integrated as the bottom wall to achieve low-profile design, then the connector profile is reduced, but manufacturing complexity may increase

Engineering Contradiction:
Improveconnector profile heightVSAvoidsubstrate integration difficulty
Core Design Contradiction:
Length of moving objectVSEase of manufacture

Solution Approach 1:

The substrate and bottom wall are merged into a single integrated component. The substrate is secured to the insulative housing to constitute the bottom wall, which simplifies the overall manufacturing process by reducing the number of separate parts that need to be assembled, despite the integrated design

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12451629B2Electrical connector having an insulative housing and a bottom substrate
Publication Date: 2025.10.21 FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO LTD
  • US12451629B2 patent drawing
  • US12451629B2 patent drawing
  • US12451629B2 patent drawing

AI summary

An electrical connector includes: an insulative housing having a top wall and a pair of side walls; and a substrate secured to the insulative housing to constitute a bottom wall of the insulative housing, the substrate having plural front conductive pads at an upper face thereof and plural rear conductive pads at a lower face thereof in electrical connection with the plural front conductive pads.