Substrate Bowl Shutter Control for Airflow and Particle Adhesion
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Solution Overview
Problem
Conventional substrate treatment apparatuses suffer from air flow-related defects that lead to particle adhesion on substrates, deteriorating their quality due to uncontrollable air flow speeds and particle scattering.
Innovation Solution
A substrate treatment apparatus with a shutter unit that adjusts the air flow inlet radius using shutter blades and a cleaning liquid supply system to control air flow speed and prevent particle adhesion, while maintaining cleanliness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the fan filter unit supplies external air to the chamber, then the chamber is ventilated, but gas-phase particles are adhered to the substrate due to uncontrollable air flow speed
Solution Approach 1:
The shutter unit is configured to be movable between an open state and a closed state, enabling dynamic adjustment of the air flow inlet radius. This allows the system to adapt air flow speed to optimal levels, preventing particle adhesion while maintaining effective ventilation when needed.
2Object-affected harmful factors
If the air flow speed is increased to prevent particle adhesion, then substrate quality is improved, but the air flow becomes too strong causing treatment liquid scattering
Solution Approach 1:
The shutter unit enables precise adjustment of the air flow inlet radius, allowing the system to optimize air flow speed within a specific range. This parameter control prevents both particle adhesion and treatment liquid scattering by maintaining air flow at an optimal velocity threshold.
3Object-affected harmful factors
If the shutter unit is added to control air flow, then particle adhesion is prevented, but the device complexity increases
Solution Approach 1:
The shutter unit is integrated into the existing bowl assembly structure, serving multiple functions: controlling air flow speed, preventing particle adhesion, and regulating ventilation. This multi-functionality reduces the need for separate control mechanisms, thereby limiting the increase in device complexity.
4Object-affected harmful factors
If the air flow is slowed down to reduce particle adhesion, then substrate quality is maintained, but gas-phase particles are not exhausted effectively
Solution Approach 1:
The system uses the shutter unit to regulate air flow based on the balance between particle adhesion prevention and particle exhaustion. By adjusting the inlet radius, the system maintains air flow speed that satisfies both requirements: slow enough to prevent adhesion but fast enough to ensure effective particle removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively controls air flow speed and prevents particle adhesion, ensuring substrate quality by minimizing contamination from gas-phase particles and scattered treatment liquids.
Implementation Method 1
a shutter unit disposed on top of the outermost bowl of the bowl assembly to adjust a radius of an air flow inlet through which air flow passes toward the substrate
Implementation Method 2
a fan filter unit (FFU) 81 is located on top of the chamber 80 to supply external air to the interior of the chamber 80
Data Source
AI summary
The present disclosure relates to a substrate treatment apparatus including: a substrate treatment apparatus including: a chuck base rotating together with a substrate in a state of supporting the substrate thereagainst; a fluid supply unit for supplying treatment liquid to the substrate; a bowl assembly having a plurality of bowls that overlap outward in a radial direction with respect to the center of the substrate in such a way as to surround the chuck base; an ascending and descending unit for moving the bowl assembly up and down; and a shutter unit disposed on top of the outermost bowl of the bowl assembly to adjust a radius of an air flow inlet through which air flow passes toward the substrate.