Substrate Positioning With Braking for Fast Precise Chip Mounting
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Solution Overview
Problem
Existing mounting devices face challenges in achieving high precision and speed when mounting chip components on large substrates, due to the increasing size of substrates and substrates stages, which affects alignment and movement speed.
Innovation Solution
A positioning device is developed that includes a substrate table, a processing position movement mechanism with a driving means and braking means, and a control unit. This device restricts movement during the attachment process using the braking means, allowing for precise alignment and high-speed movement of the substrate stage and bonding head.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the substrate stage size is increased to accommodate large substrates, then the substrate can be held and positioned, but the alignment speed decreases
Solution Approach 1:
The braking means is activated in advance before the attachment process to pre-restrict the movement of the substrate stage or bonding head. This preliminary action ensures that the positioning system is already stabilized when the attachment process begins, eliminating the need for slow alignment during the actual mounting operation and thereby maintaining high alignment speed despite the large substrate stage size.
Solution Approach 2:
The system dynamically switches between movement and restriction states by controlling the braking means. During positioning phases, the braking means is released to allow movement; during attachment phases, it is activated to restrict movement. This dynamic control optimizes both the ability to handle large substrates and the speed of alignment by adapting the system's rigidity to the operational requirements.
2Area of stationary object
If the substrate stage size is increased to accommodate large substrates, then the substrate can be held and positioned, but the takt time increases
Solution Approach 1:
The braking means is activated in advance before the attachment process to pre-restrict the movement of the substrate stage or bonding head. This preliminary action ensures that the positioning system is already stabilized when the attachment process begins, eliminating the need for slow alignment during the actual mounting operation and thereby maintaining high alignment speed despite the large substrate stage size.
Solution Approach 2:
By restricting movement during the attachment process, the system ensures continuous and uninterrupted attachment operations. The braking means maintains stable positioning throughout the entire attachment sequence, preventing any time loss due to mid-process adjustments or re-alignments, thus reducing overall takt time while handling large substrates.
3Device complexity
If the bonding head is moved to each mounting location to reduce device size, then the device size is reduced, but tilt is generated in the bonding head during pressure bonding
Solution Approach 1:
The braking means is activated in advance before the attachment process to pre-restrict the movement of the substrate stage or bonding head. This preliminary action ensures that the positioning system is already stabilized when the attachment process begins, eliminating the need for slow alignment during the actual mounting operation and thereby maintaining high alignment speed despite the large substrate stage size.
Solution Approach 2:
The braking means acts as an intermediary mechanism that decouples the movement function from the attachment function. By introducing this intermediate restriction mechanism, the system can move the bonding head to different locations without carrying over movement-induced tilts into the attachment phase, thus maintaining precision while allowing device compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The positioning device enables high-precision and high-speed alignment of chip components and large substrates, facilitating efficient mounting with improved takt time performance.
Implementation Method 1
a braking means for restricting the movement, caused by the driving means, of at least one of the substrate table and the processing means
Data Source
AI summary
A positioning device is provided for determining a relative position between a substrate and a processing unit that is configured to perform an attachment process, when performing the attachment process at a prescribed position of the substrate. The positioning device comprises a substrate table configured to hold the substrate, a processing position movement mechanism including a driving unit configured to move the substrate table and the processing unit relative to each other, and a braking unit configured to restrict movement, caused by the driving unit, of at least one of the substrate table and the processing unit, and a control unit connected to the driving unit and the braking unit. The control unit is configured to restrict, by using the braking unit, the movement of the at least one of the substrate table and the processing unit during the attachment process.