Substrate Bridge Structures for High-Density Package Interconnects
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Solution Overview
Problem
Conventional microelectronic packages face limitations in interconnect density, signal transfer speed, and miniaturization due to costly manufacturing operations such as fine-pitch via formation and first-level interconnect plating.
Innovation Solution
The implementation of microelectronic structures with bridges in cavities of substrates, allowing for higher interconnect densities without the expense of conventional costly manufacturing operations, by using a substrate with a bridge component that includes conductive pathways and a cavity for increased electrical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional solder attachment methods are used to attach die to organic package substrate, then manufacturing process is simple, but interconnect density is limited
Solution Approach 1:
The patent introduces a bridge component with conductive pathways that extends vertically from the substrate surface, transitioning the interconnect structure from a planar two-dimensional arrangement to a three-dimensional configuration. This vertical dimension allows multiple interconnect levels without increasing lateral footprint, thereby increasing interconnect density while avoiding complex fine-pitch via formation processes.
Solution Approach 2:
The bridge component acts as an intermediary structure between the substrate and the die, providing conductive pathways that enable electrical coupling without requiring direct solder attachment to the substrate. This mediator approach simplifies the manufacturing process by eliminating the need for complex first-level interconnect plating while achieving high interconnect density.
2Quantity of substance
If fine-pitch via formation and first-level interconnect plating are used, then interconnect density increases, but manufacturing cost increases
Solution Approach 1:
The bridge component is fabricated using standard organic substrate manufacturing processes that are already in place, avoiding the need for expensive fine-pitch via formation and plating equipment. The bridge structure itself serves as the interconnect medium, eliminating the need for additional costly interconnect layers and reducing overall manufacturing cost while maintaining high interconnect density.
3Speed
If conventional package structures are used, then manufacturing process is simple, but signal transfer speed is limited
Solution Approach 1:
The vertical bridge structure reduces the lateral distance that signals must travel across the substrate, enabling faster signal transfer. By routing signals through the vertical bridge component rather than across the substrate plane, the patent achieves shorter signal paths and improved transfer speed without significantly increasing overall structure complexity.
Data Source
AI summary
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.