Substrate Brush Cleaning Sequence for Dust-Free Wafer Surfaces
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Solution Overview
Problem
Existing substrate cleaning apparatuses face issues with brush deformation causing dust contamination due to low peripheral velocity at the rotational center, leading to incomplete dust removal and substrate contamination.
Innovation Solution
A method and apparatus that rotate the substrate around a vertical shaft axis, contact the brush at the outer periphery edge with higher peripheral velocity, and move it towards the shaft axis, followed by multiple cleaning passes to discharge dust efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the brush contacts the substrate at the rotational center, then the brush can clean the substrate surface, but the brush deformation releases dust that contaminates the substrate due to low peripheral velocity
Solution Approach 1:
The brush is pre-deformed by pressing it against a pressed member before contacting the substrate. This preliminary action discharges dust from the brush at a position with higher peripheral velocity where dust can be effectively discharged, preventing subsequent substrate contamination during the cleaning process
Solution Approach 2:
Instead of contacting the brush at the rotational center and moving outward, the invention contacts the brush at an outer position closer to the periphery and moves it toward the shaft axis. This inverted approach ensures dust is discharged at high peripheral velocity positions rather than low velocity positions near the center
2Productivity
If the brush is pressed against the substrate to perform cleaning, then cleaning efficacy is improved, but brush deformation occurs releasing dust that cannot be discharged at low peripheral velocity
Solution Approach 1:
The brush undergoes preliminary deformation by pressing against the pressed member before substrate contact. This pre-action discharges accumulated dust from the brush when peripheral velocity is high, preventing dust release during the actual cleaning operation on the substrate
Solution Approach 2:
A pressed member is introduced as an intermediary between the brush and substrate. The brush is pressed against this pressed member to achieve deformation and dust discharge without directly contacting the substrate at the rotational center, thus preventing contamination
3Reliability
If the brush is cleaned in the standby pot, then some dust is removed, but dust cannot be completely removed and remains in the brush
Solution Approach 1:
The brush is pre-deformed and dust is discharged before substrate contact, serving as an additional preliminary cleaning action beyond the standby pot cleaning. This ensures residual dust is removed at high peripheral velocity positions
Solution Approach 2:
The peripheral velocity parameter is utilized to enhance dust discharge effectiveness. By performing brush deformation and dust discharge at positions with higher peripheral velocity, the cleaning effectiveness is improved compared to static or low-velocity cleaning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents substrate contamination by effectively discharging dust using high peripheral velocity and multiple cleaning passes, enhancing cleaning efficacy and reducing environmental impact.
Implementation Method 1
The substrate is rotated around the vertical shaft axis... the peripheral velocity is higher than that at the shaft axis... The dust is discharged toward an outer periphery of the substrate due to the high peripheral velocity
Data Source
AI summary
Disclosed is a substrate treating method for performing cleaning treatment to a substrate by contacting a brush against the substrate. The method includes a rotating step of rotating a spin holder, holding the substrate, around a vertical shaft axis, an outer periphery edge contacting step of contacting the brush against the substrate at an outer periphery edge contacting position closer to an outer periphery edge of the substrate than to the shaft axis while the substrate is rotated in a horizontal plane, a first moving step of moving the brush from the outer periphery edge contacting position to a side adjacent to the shaft axis while the brush is brought into contact against the substrate, and a second moving step of moving the brush from the side adjacent to the shaft axis toward the outer periphery edge after the first moving step.