Substrate Brush Cleaning Sequence to Avoid Nozzle Interference
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional substrate processing apparatuses face inefficiencies in particle removal due to interference between the brush and chemical liquid nozzle, limiting the effectiveness of cleaning methods that use either pure water and a brush or chemical liquid alone.
Innovation Solution
A substrate processing method and apparatus that employs a movable brush and offset rinsing liquid and chemical liquid nozzles, allowing for sequential cleaning steps that utilize both rinsing liquid and chemical liquid, with the brush moving from the center to the perimeter while the nozzles are positioned to avoid interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the chemical liquid nozzle is positioned above the center of the substrate to clean the central part, then the cleaning effectiveness is improved, but the brush and chemical liquid nozzle interfere with each other
Solution Approach 1:
The substrate surface is divided into two regions: a central region cleaned by the chemical liquid nozzle and a peripheral region cleaned by the brush. This spatial segmentation allows both cleaning mechanisms to operate simultaneously without interference, with the chemical liquid nozzle positioned above the center and the brush operating on the peripheral area.
Solution Approach 2:
Different cleaning methods are applied to different regions of the substrate: chemical liquid is used for the central part where the brush cannot reach effectively, while brush cleaning is applied to the peripheral region where mechanical action is more effective. This local differentiation optimizes cleaning effectiveness for each region.
2Device complexity
If only pure water and brush are used for cleaning, then the device complexity is reduced, but the particle removal efficiency is insufficient
Solution Approach 1:
The cleaning system merges two cleaning methods: chemical liquid cleaning and brush cleaning with pure water. The chemical liquid nozzle and brush operate simultaneously on different regions of the substrate, combining the advantages of both methods to achieve high particle removal efficiency while maintaining relatively simple device structure.
3Duration of action of stationary object
If chemical liquid is used without brush for cleaning, then the brush lifetime is extended, but the particle removal efficiency in peripheral regions is insufficient
Solution Approach 1:
The cleaning task is segmented between chemical liquid and brush: chemical liquid handles the central region while the brush handles the peripheral region. This segmentation allows the brush to be used only where mechanically effective, extending its lifetime by avoiding unnecessary exposure to chemical liquid while maintaining high particle removal efficiency in peripheral areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances particle removal efficiency, reduces processing time, extends brush lifetime, and minimizes chemical liquid usage by combining rinsing liquid and brush cleaning, preventing nozzle interference and optimizing cleaning power.
Implementation Method 1
a brush that is movable from a center of the substrate toward a perimeter of the substrate and performs brushing by exerting force onto an upper surface of the substrate
Implementation Method 2
a rinsing liquid nozzle that is provided at a fixed position offset from the center of the substrate and discharges a rinsing liquid onto the upper surface of the substrate
Implementation Method 3
a chemical liquid nozzle that is movable from a retracted position offset from the center of the substrate toward the center of the substrate, and that discharges a chemical liquid downwards onto the upper surface of the substrate from above the center of the substrate
Data Source
AI summary
The present invention relates to a substrate processing method and a substrate processing apparatus. A substrate processing method includes: a rinsing liquid/brush cleaning step of moving a brush exerting force onto an upper surface of a substrate from a center of the substrate toward a perimeter of the substrate while causing a fixed nozzle to discharge a rinsing liquid onto the upper surface of the substrate rotated by a holding and rotating unit; a rinsing liquid stopping step of stopping discharge of the rinsing liquid from the fixed nozzle when the brush having moved toward the perimeter of the substrate arrives at a switching position set in advance between the center of the substrate and the perimeter of the substrate; and a chemical liquid/brush cleaning step of moving, after the rinsing liquid stopping step, the brush exerting force on the upper surface of the substrate from the switching position toward the perimeter of the substrate while causing the chemical liquid nozzle to discharge the chemical liquid onto the upper surface of the substrate being rotated.