Substrate Buffer Transfer with Dual Forks and Lift Pins
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Solution Overview
Problem
The existing substrate transfer methods in substrate processing systems are inefficient, requiring excessive time to exchange substrates due to the sequential unloading and loading processes in load locks and buffer chambers, which increases processing time and can lead to positional misalignment issues.
Innovation Solution
A substrate transfer method utilizing a transfer mechanism with dual forks and lift pins in a buffer chamber, allowing simultaneous support and transfer of substrates, reducing the time required for exchange by lifting and repositioning substrates using multiple lift pins and forks, thereby correcting positional misalignment and optimizing the transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If sequential unloading and loading processes are used in load locks and buffer chambers, then substrate transfer can be performed, but the time required for substrate exchange increases
Solution Approach 1:
The buffer chamber pre-positions substrates on the mounting part before the transfer mechanism arrives. The lift pins are already in place and ready to support the substrate, eliminating the need for sequential positioning operations during the actual transfer, thus reducing substrate exchange time and improving throughput.
Solution Approach 2:
The buffer chamber acts as an intermediary between the load lock and processing chambers. It temporarily holds substrates in a pre-positioned state, allowing the transfer mechanism to efficiently move substrates without waiting for sequential unloading/loading operations, thereby reducing exchange time and enhancing productivity.
2Manufacturing precision
If substrates are transferred using a single fork transfer mechanism, then the structure remains simple, but positional misalignment occurs during transfer
Solution Approach 1:
The lift pins in the buffer chamber serve as an intermediary support system between the single fork transfer mechanism and the substrate. The pins provide additional contact points that constrain substrate movement and prevent misalignment during transfer, achieving high positioning accuracy without requiring a complex multi-fork transfer mechanism.
Solution Approach 2:
The buffer chamber provides localized support at specific points through the lift pins and mounting part. This localized support system ensures precise substrate positioning during transfer by providing targeted contact points that maintain alignment, achieving high manufacturing precision without increasing overall device complexity.
Data Source
AI summary
This substrate conveyance method is disclosed for a conveyance device. A conveyance chamber includes a conveyance mechanism having forks, on upper and lower sides, and support a substrate. A buffer chamber is connected to the conveyance chamber, and includes: a mounting unit that mounts a substrate; and, pins that support the substrate. In the method, the conveyance mechanism, with a second substrate supported by the lower fork, is inserted into the buffer chamber in which a first substrate is mounted on the mounting unit, and the first substrate is lifted by the upper fork. In the method, the pins are raised while the first substrate is lifted by the upper fork, and the second substrate supported by the lower fork is lifted by the pins. In the method, the conveyance mechanism is removed from the buffer chamber while the second substrate is lifted by the pins.