Substrate Treatment Buffer Space for Uniform Supercritical Fluid Flow
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Solution Overview
Problem
Existing substrate treating apparatuses using supercritical fluids face challenges in achieving uniform fluid distribution within the treating space, leading to asymmetric fluid flow and particle concentration issues during high-speed fluid supply.
Innovation Solution
The substrate treating apparatus incorporates a housing with a filler member that forms a buffer space and a passage for the process fluid, ensuring uniform distribution and flow, even when the fluid is supplied at high speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the supply port is disposed biased from the center of the treating space, then the device complexity is reduced, but the uniformity of supercritical fluid distribution deteriorates
Solution Approach 1:
The supply port is divided into multiple nozzles arranged in a specific pattern. Instead of using a single biased supply port, the fluid is supplied through multiple distributed nozzles that collectively cover the treating space, achieving both simplified structure and uniform distribution
Solution Approach 2:
The nozzles are arranged in an asymmetric pattern relative to the center, with different nozzle positions and orientations designed to compensate for the biased location, creating symmetric fluid distribution through asymmetric structural configuration
2Productivity
If the supercritical fluid is supplied at a high speed, then the productivity is improved, but the uniformity of fluid flow deteriorates due to enhanced asymmetry
Solution Approach 1:
The nozzle configuration is designed to dynamically adapt to high-speed fluid supply conditions, with nozzle angles and positions optimized for high flow rates to maintain uniform distribution even at increased productivity levels
Solution Approach 2:
Different nozzles have different flow rates and spray patterns tailored to their specific positions, with nozzles in areas requiring more fluid providing higher flow rates, thereby maintaining overall uniformity despite high-speed operation
3Manufacturing precision
If the supply port is positioned to overlap the buffer space, then the fluid flow uniformity is improved, but the device complexity increases
Solution Approach 1:
The buffer space is integrated into the housing structure itself rather than being a separate component. The housing walls form the buffer space boundaries, merging the housing and buffer functions into a single structural element, thereby reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses particle concentration at specific regions of the substrate, enabling uniform processing and improving the overall efficiency of the substrate treatment process.
Implementation Method 1
a carbon dioxide (CO2) may be supplied to the top surface of the substrate in a supercritical state to remove a remaining anti-leaning liquid
Data Source
AI summary
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing for providing a treating space for treating a substrate within; a support unit for supporting the substrate in the treating space; a bottom supply port for supplying a process fluid to the treating space; and a filler member positioned below the substrate supported on the support unit in the treating space, and wherein the filler member forms a buffer space facing the bottom supply port, and a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate.