Substrate Transfer Buffer Layout for Higher Wafer Processing Throughput
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Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in achieving high throughput due to the inefficient utilization of substrate handling mechanisms, as processed substrates are returned one by one to a cassette in single wafer type modules, while unprocessed substrates are transferred one by one from cassettes in batch type modules, negating the advantages of collective handling.
Innovation Solution
A substrate processing apparatus is designed with a stocker block, transfer block, and processing block configuration that allows for continuous batch and single wafer processing, incorporating attitude changing mechanisms and substrate handling mechanisms to facilitate collective transfer and processing of substrates, reducing transfer distances and optimizing throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are transferred one by one from cassette to single wafer type module, then substrate processing can be performed sequentially, but throughput is reduced and the advantage of collective handling is not utilized
Solution Approach 1:
The substrate transfer process is segmented into two distinct phases: collective transfer of multiple substrates from cassette to batch type module, and individual transfer from batch type module to single wafer type module. This segmentation allows the substrate handling mechanism to optimize for collective handling in the first phase, improving overall throughput while maintaining necessary individual processing in the second phase.
Solution Approach 2:
The substrate handling mechanism is designed with multi-functionality to perform both collective substrate transfer (handling multiple substrates simultaneously) and individual substrate transfer (handling single substrates). This universal capability allows the same mechanism to serve dual purposes: maximizing throughput during collective transfer to batch module, and enabling precise individual transfer to single wafer module, thereby resolving the throughput limitation without requiring separate mechanisms.
2Productivity
If substrate handling mechanism collectively takes out substrates, then throughput is improved, but the mechanism is not utilized effectively when returning processed substrates to cassette one by one
Solution Approach 1:
The transfer process is segmented into distinct stages with different handling modes: collective transfer from cassette to batch module, individual transfer from batch module to single wafer module, and collective return from single wafer module to cassette. This segmentation allows the substrate handling mechanism to operate in collective mode for both input and output operations, fully utilizing its capability while maintaining manageable process complexity through clear stage differentiation.
Solution Approach 2:
The invention merges the collective transfer capability with the return process by enabling the substrate handling mechanism to collectively transfer processed substrates from the single wafer type module back to the cassette. This merging of collective handling into both input and output operations maximizes the utilization of the substrate handling mechanism's capabilities, improving throughput without proportionally increasing complexity since the same mechanism performs both functions.
3Productivity
If apparatus configuration uses conventional one-by-one transfer method, then substrate processing is simplified, but the advantage of substrate handling mechanism is not utilized
Solution Approach 1:
The operational process is segmented into distinct phases: collective loading from cassette to batch module, individual processing in single wafer module, and collective return to cassette. This segmentation maintains operational simplicity by using clear, discrete steps while enabling the substrate handling mechanism to operate in its optimal collective mode during loading and unloading, thereby improving throughput without significantly complicating the operational procedure.
Solution Approach 2:
The substrate handling mechanism is designed with universal capability to perform both collective and individual transfer operations. This multi-functionality allows the system to maintain ease of operation by using a single unified mechanism for all transfer operations, while still achieving high throughput through collective handling during cassette I/O operations, avoiding the need for multiple specialized mechanisms that would increase operational complexity.
Data Source
AI summary
There is provided a substrate processing apparatus with improved throughput by reconsidering a configuration of an apparatus including a batch type module and a single wafer type module. In a single wafer processing region according to single wafer processing of a processing block of the present invention, a buffer unit to and from which both a first transfer mechanism HTR and a center robot can hand over and receive a substrate(s) is provided. Therefore, the first transfer mechanism can collectively hand over and receive processed substrates and unprocessed substrates via the buffer unit. Therefore, a potential of the first transfer mechanism is drawn out, and the substrate processing apparatus having a high throughput can be provided.