Substrate Buffer Unit Structure for Vibration Isolation and Cooling
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Solution Overview
Problem
Vibration in substrate treating apparatuses causes substrates to be displaced or separated from buffer units, disrupting the manufacturing process.
Innovation Solution
Incorporation of anti-vibration pads between support plates and connection blocks in the buffer unit, along with varying thicknesses and materials to absorb and dissipate vibration, and the inclusion of cooling fluid pathways for efficient substrate cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the buffer unit uses a rigid structure to maintain stability, then structural strength is improved, but vibration is transmitted to the substrate causing displacement
Solution Approach 1:
The patent introduces an anti-vibration pad as an intermediary element between the support plate and connection blocks. This pad acts as a mediator that decouples the rigid structural connection while providing vibration isolation, allowing the buffer unit to maintain both structural strength and vibration resistance simultaneously
Solution Approach 2:
The patent employs composite material construction by combining rigid components (support plates, connection blocks) with flexible vibration-absorbing materials (anti-vibration pads). This composite approach allows different parts of the structure to serve different functions: rigid parts provide strength while flexible parts absorb vibration
2Object-affected harmful factors
If anti-vibration pads are added between support plates and connection blocks, then vibration transmission is reduced, but device complexity increases
Solution Approach 1:
The patent applies the anti-vibration pads only at specific critical locations where vibration transmission occurs between support plates and connection blocks, rather than throughout the entire structure. This localized application reduces complexity while effectively addressing the vibration problem
Solution Approach 2:
The anti-vibration pads are implemented as simple, replaceable components that can be easily installed and replaced if needed. These inexpensive elements provide effective vibration isolation without requiring complex mechanisms, making the overall system simpler despite the added component
3Length of stationary object
If support plates are closely spaced to reduce buffer unit height, then compactness is improved, but vibration isolation capability deteriorates
Solution Approach 1:
The patent changes the physical parameters of the connection blocks by incorporating anti-vibration pads that alter the mechanical properties of the connection. This allows the support plates to be closely spaced while maintaining vibration isolation through the modified connection characteristics rather than through spacing alone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces vibration transmission, stabilizes substrate positioning, and enhances processing efficiency by minimizing displacement and enabling faster cooling within the buffer unit.
Implementation Method 1
an anti-vibration pad disposed between the support plate and the connection block to prevent vibration from being transmitted from the bottom to the top
Implementation Method 2
a cooling flow path through which a cooling fluid for cooling the substrate flows
Implementation Method 3
a cooling flow path through which a cooling fluid for cooling the substrate flows
Data Source
AI summary
Disclosed are a buffer unit, in which a plurality of support plates is stacked in a vertical direction and a connection block is provided between the plurality of support plates to prevent vibration generated at the lower end of the support plate from being transmitted from the upper support plate, and a substrate treating apparatus. According to the present invention, it is possible to reduce the vibration generated in the buffer unit, so that there is an effect of improving the efficiency of the substrate treating process.