Substrate Bump Layout for Uniform Bonding Height and Lower Stress
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing electronic components face challenges with bump bonding, particularly due to pressure concentration and stress concentration during the bonding process, leading to potential bonding failures and uneven Z-direction heights of bumps near the edges of arrays.
Innovation Solution
The electronic component design includes a first substrate with a first surface having a first region with multiple first bumps and a second region with fewer second bumps, and a second substrate with a second surface having third and fourth regions with corresponding bumps, where the fourth surface is closer to the second surface, reducing pressure concentration and stress concentration by bonding the second and fourth bumps through the fourth surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bump bonding is performed on all bumps in the array, then electrical connection is achieved, but pressure concentration and stress concentration occur leading to bonding failures
Solution Approach 1:
The patent extracts or removes certain bumps (second bumps and fourth bumps) from the complete array configuration. By intentionally leaving fewer bumps in specific regions, the design reduces pressure concentration and stress concentration during bonding while maintaining sufficient electrical connection capability through the remaining bumps (first bumps and third bumps).
Solution Approach 2:
The patent applies different bump configurations to different regions of the substrate. The first region contains a complete array of first bumps, while the second region has fewer second bumps. Similarly, the third region has complete third bumps while the fourth region has fewer fourth bumps. This local differentiation allows optimal bonding reliability in critical areas while reducing stress in less critical areas.
2Manufacturing precision
If bumps are bonded uniformly across the substrate, then manufacturing simplicity is maintained, but Z-direction height uniformity deteriorates near array edges
Solution Approach 1:
The patent introduces asymmetric bump distribution across the substrate. Instead of uniform bump arrays, the design features different bump configurations in different regions (complete arrays in first and third regions, reduced arrays in second and fourth regions). This asymmetric arrangement compensates for edge effects and improves Z-direction height uniformity throughout the substrate.
Solution Approach 2:
The patent segments the substrate into four distinct regions with different bump configurations. This segmentation allows independent optimization of each region's bump arrangement, enabling better control over bonding characteristics and Z-height uniformity across the entire substrate while maintaining manageable manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design helps in achieving a more uniform Z-direction height and reducing stress concentration during bonding, thereby preventing bonding failures and ensuring a more reliable connection between the substrates.
Implementation Method 1
bonding the first bumps and the third bumps to each other; and bonding the second bump and the fourth bump to each other
Data Source
AI summary
An electronic component includes: a first substrate having a first surface with a first region and a second region, a plurality of first bumps provided in the first region, and zero or one or more second bumps provided in the second region, the number of second bumps being smaller than the number of first bumps; and a second substrate having a second surface with a third region facing the first surface and the first region and a fourth region facing the second region, a plurality of third bumps provided in the third region and in contact with the first bumps, zero or one or more fourth bumps provided in the fourth region and in contact with the second bumps, a third surface provided on a side opposite to the third region and having a first distance from the second surface, and a fourth surface provided on a side opposite to the fourth region and having a second distance from the second surface shorter than the first distance, the number of fourth bumps being smaller than the number of third bumps.