Circuit Board Substrate Cable Routing for Thermal Management
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Solution Overview
Problem
Existing electronic devices face challenges in suppressing temperature rises of heat-generating components while maintaining device compactness, as additional heat dissipation paths can hinder downsizing efforts.
Innovation Solution
The design incorporates a first substrate with a heat-generating component and a connector, a second substrate with another heat-generating component and its corresponding connector, and a cable routed through a hole in the second substrate, allowing for effective heat management by positioning the connectors to minimize heat transfer and optimize size reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a second path for dissipating heat is provided on the first circuit board, then heat dissipation performance is improved, but device size increases
Solution Approach 1:
The patent divides the circuit board into two distinct regions: a first region for mounting connectors and a second region for mounting heat-generating components. This spatial segmentation allows heat to be directed away from connectors through regional separation, eliminating the need for additional dedicated heat dissipation paths while effectively managing thermal distribution across the board.
Solution Approach 2:
The patent applies local quality by creating region-specific functional zones on the circuit board. The first region is optimized for electrical connectivity with connector mounting, while the second region is optimized for heat generation and dissipation. This localized functional differentiation enables effective heat management without requiring extra heat dissipation infrastructure, thus avoiding size increase.
2Productivity
If processing capability of IC is enhanced, then functionality and performance are improved, but power consumption and heat generation increase
Solution Approach 1:
The patent segments the circuit board into distinct thermal zones, separating heat-generating components from heat-sensitive connectors. This segmentation allows high-power ICs to operate at enhanced processing capabilities while their heat is directed to designated dissipation regions, preventing thermal interference with other components and enabling sustained high performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses temperature rises of heat-generating components and reduces the overall size of the electronic device by strategically routing heat dissipation paths, enhancing performance and user comfort.
Implementation Method 1
the heat generated in the image pickup device flows to the metal housing through the second path
Data Source
AI summary
An electronic device capable of suppressing a temperature rise of a heat generating component and reducing the size of the heat generating component. The electronic device comprising a first substrate on which a first electronic component that generates heat during operation and a first connector are mounted, a second substrate on which a second electronic component that generates heat during operation and a second connector are mounted, and a cable having one end connected to the first connector and the other end connected to the second connector. In the electronic device, the second substrate has a hole defining the second substrate into a first region and a second region, and the cable is inserted through the hole, and on the second substrate, the second connector is mounted in the first region, and the second electronic component is mounted in the second region.