Substrate Carrier Coupling Chamber for Faster Vacuum Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The complexity of substrate processing in a vacuum environment leads to increased manufacturing time and cost due to complex movement paths and increased number of process chambers, necessitating a reduction in substrate and carrier residence time.
Innovation Solution
A substrate processing apparatus and method that includes a coupling chamber with a first transfer part and stage for concurrent coupling of substrates and carriers, and a separation chamber with a second transfer part and stage for simultaneous separation, utilizing inclined angles and grip portions to enhance efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple processes are carried out on multiple substrates with complex carrier movement paths, then manufacturing capability is improved, but process time and residence time increase
Solution Approach 1:
The patent combines the substrate transfer function and carrier transfer function into a single integrated transfer mechanism. The transfer mechanism simultaneously transfers the substrate from the substrate transfer mechanism and the carrier from the carrier transfer mechanism to the processing chamber, eliminating the need for separate transfer operations and reducing process time while maintaining the ability to handle multiple substrates.
Solution Approach 2:
The substrate and carrier are transferred to predetermined positions within the processing chamber before the processing operation begins. The substrate transfer mechanism positions the substrate on the carrier, and the carrier transfer mechanism positions the carrier at the processing location in advance, so that processing can start immediately without additional positioning time during the actual processing operation.
2Productivity
If the number of process chambers is increased to handle multiple substrates, then manufacturing capability is improved, but device complexity increases
Solution Approach 1:
The processing chamber is designed to perform multiple functions: it serves as both the substrate processing chamber and the carrier processing chamber. The same chamber environment and processing conditions are used for treating both substrates and carriers, eliminating the need for separate dedicated chambers for each type of processing while maintaining manufacturing capability.
Solution Approach 2:
The patent merges the substrate processing function and carrier processing function into a single processing chamber. Both the substrate and carrier are processed simultaneously within the same chamber under the same vacuum or atmospheric conditions, reducing the total number of chambers required while preserving the ability to handle multiple substrates through sequential or parallel processing.
3Productivity
If concurrent coupling and separation operations are implemented, then productivity is improved, but manufacturing precision may be affected
Solution Approach 1:
The coupling and separation operations are divided into distinct operational phases within the processing chamber. The substrate transfer mechanism and carrier transfer mechanism operate in coordinated but separate sequences: first positioning operations are completed with high precision, then coupling operations are performed, followed by processing, and finally separation operations are executed. This segmentation allows each phase to be optimized independently for both precision and speed.
Solution Approach 2:
The processing chamber acts as an intermediary environment that enables concurrent coupling and separation operations. By providing a controlled vacuum or atmospheric environment with precise positioning capabilities, the chamber allows the substrate and carrier to be coupled accurately during transfer, processed simultaneously, and then separated with maintained precision, reconciling the conflict between speed and accuracy.
Data Source
AI summary
A substrate processing apparatus and a substrate processing method are disclosed. A substrate processing method includes loading a substrate into a first load-lock chamber, loading the substrate and a carrier into a coupling chamber including a first transferer, seating the substrate on a first stage connected to the first transferer, transferring the carrier in a first direction using the first transferer and coupling the carrier with the substrate seated on the first stage concurrently, and unloading the substrate and the carrier from the coupling chamber.