Substrate Carrier Dielectric Layer Planarity Without Edge Flaking
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Solution Overview
Problem
Conventional substrate carriers face issues with dielectric layers flaking off, leading to particle generation and cracking, which reduce product yield and increase downtime due to non-planar surfaces and overhanging edges.
Innovation Solution
A method of forming a substrate carrier using an inkjet process to dispense droplets of dielectric material with varying sizes, quantities, and compositions over the substrate, aligning the dielectric layer's edge with the substrate edge and ensuring a flat surface without the need for additional removal processes like CMP or etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional dielectric layer formation methods are used, then the dielectric layer can be formed on the substrate carrier, but the dielectric layer develops non-planar surfaces and overhanging edges that lead to flaking, particle generation, and cracking
Solution Approach 1:
The inkjet process applies dielectric material with locally controlled droplet sizes and compositions at different locations on the substrate carrier, ensuring uniform planar surfaces and precise edge alignment without overhanging edges that would otherwise flake and generate particles
Solution Approach 2:
The patent varies droplet size parameters and dielectric material composition parameters during the inkjet dispensing process to achieve optimal dielectric layer formation with planar surfaces and precise edge alignment, preventing flaking and cracking
2Reliability
If the dielectric layer is formed to cover the electrode segments, then electrostatic clamping is enabled, but additional removal processes like CMP or etching are required to achieve flat surfaces
Solution Approach 1:
The inkjet process is configured to dispense dielectric material with precise edge alignment to the substrate edge from the beginning, forming a planar surface that eliminates the need for subsequent removal processes like CMP or etching, thereby reducing device complexity
Solution Approach 2:
The inkjet dispensing process inherently produces a self-aligned dielectric layer with flat surfaces and precise edges through controlled droplet deposition, eliminating the need for additional service processes to correct surface irregularities
3Ease of manufacture
If uniform droplet sizes are used in the inkjet process, then the dispensing process is simplified, but the dielectric layer cannot achieve optimal flatness and edge alignment
Solution Approach 1:
The inkjet process uses varying droplet sizes at different locations on the substrate carrier, with larger droplets in certain areas and smaller droplets in others, to achieve optimal dielectric layer formation with flat surfaces and precise edge alignment while maintaining a controlled dispensing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents cracking, scratching, and particle generation by ensuring a flat dielectric layer edge alignment and surface, enhancing carrier durability and reducing maintenance costs.
Implementation Method 1
dispensing a plurality of droplets of a dielectric material over the substrate and into the plurality of gaps
Implementation Method 2
The dielectric layer allows the electric field from the electrical charge provided to the electrode of the substrate carrier to be coupled to the substrate, so that the substrate can be electrostatically clamped to the substrate carrier
Data Source
AI summary
A method of forming a substrate carrier is provided. The method includes forming a first electrode over a first surface of a substrate, the first electrode arranged in a first pattern including a plurality of segments, wherein portions of the plurality of segments are spaced apart from each other by a plurality of gaps; and dispensing a plurality of droplets of a dielectric material over the substrate and into the plurality of gaps. The plurality of droplets includes a first droplet and a second droplet, the first droplet is dispensed onto a first location over the substrate, the second droplet is dispensed onto a second location over the substrate, a size of the first droplet is at least 10% larger than a size of the second droplet.