Substrate Carrier Motion for Uniform Large-Area Electroplating

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Solution Overview

Problem

The electrochemical deposition process on large substrates with surface areas exceeding 2.5m² experiences significant voltage drop and electric field differences, leading to non-uniform thickness of the metal plating layer, which affects the reliability and uniformity of the deposition.

Innovation Solution

An electrochemical deposition apparatus with a substrate carrier and driving assembly that allows controlled movement of the substrate along intersecting planes, combined with an injection plate design for uniform distribution of plating solution and adjustable outlet positions, to ensure consistent electric field distribution and layer thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If electrochemical deposition is performed on large substrates with surface areas exceeding 2.5m², then the substrate area is increased, but voltage drop and electric field differences cause non-uniform metal plating layer thickness

Engineering Contradiction:

Improvesubstrate areaVSAvoidplating layer thickness uniformity

Core Design Contradiction:

Area of stationary objectVSManufacturing precision

Solution Approach 1:

The substrate carrier is designed to move dynamically within the plating solution during electrochemical deposition. The driving assembly enables the substrate carrier to translate along the length direction and rotate around the width direction, allowing different portions of the large substrate to sequentially pass through regions with varying electric field intensities. This dynamic movement compensates for the voltage drop and electric field non-uniformity inherent in large-area substrates, ensuring more uniform plating layer thickness across the entire substrate surface.

Inventive Principle:

Principle #15Dynamics

2Device complexity

If a fixed substrate carrier is used, then the device structure is simple, but the electric field distribution is non-uniform leading to poor plating quality

Engineering Contradiction:

Improvedevice structureVSAvoidplating layer thickness uniformity

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The substrate carrier transitions from a static to a dynamic component with two degrees of freedom: translation along the length direction and rotation around the width direction. This dynamic capability allows the substrate to be repositioned during deposition, enabling uniform electric field distribution and consistent plating quality without requiring an overly complex device structure.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system changes the positional parameters of the substrate carrier dynamically during the deposition process. By adjusting the carrier's position and orientation, the electric field distribution parameters are optimized to achieve uniform plating across the large substrate area, resolving the conflict between structural simplicity and plating precision.

Inventive Principle:

Principle #35Parameter changes

3Ease of operation

If the substrate carrier is fixed in position, then the device operation is simple, but the plating solution distribution is non-uniform affecting deposition consistency

Engineering Contradiction:

Improvedevice operationVSAvoiddeposition consistency

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The substrate carrier's dynamic movement along the length direction and rotation around the width direction ensures that the plating solution is distributed more uniformly across the large substrate surface. This movement prevents stagnant zones and ensures consistent solution flow and concentration distribution, improving deposition consistency while maintaining relatively simple device operation.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus enhances the uniformity of the metal plating layer thickness on large substrates by mitigating voltage drop and electric field variations, improving the reliability and consistency of the deposition process.

Implementation Method 1

The electrochemical deposition process on large substrates with surface areas exceeding 2.5m² experiences significant voltage drop and electric field differences

Methodology Applied

Scientific EffectElectric Field: Electric Field

Implementation Method 2

injection plate design for uniform distribution of plating solution and adjustable outlet positions

Methodology Applied

Scientific EffectFluid Flow:

Implementation Method 3

The electrochemical deposition process is a low-cost chemical method for forming a film by which a metal layer with any thickness may be obtained

Methodology Applied

Scientific EffectElectrochemical deposition: Electrodeposition

Data Source

PatentUS20260028742A1Electrochemical deposition apparatus

Publication Date: 2026.01.29 BOE TECHNOLOGY GROUP CO LTD

AI summary

An electrochemical deposition apparatus is provided to include a process groove body with an accommodating groove is configured to accommodate a plating solution; a substrate carrier including a carrying surface for carrying a substrate to be plated, and at least a portion of the substrate carrier is in the accommodating groove; and at least one driving assembly on the process groove body and configured to control the substrate carrier to move along a first plane, wherein the first plane intersects with a normal direction of the carrying surface.