Multi-Layered Electrostatic Substrate Carrier for Size Heterogeneity
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Solution Overview
Problem
Current substrate carriers used in semiconductor manufacturing deform and change size at elevated temperatures, limiting their useful temperature range and requiring multiple configurations for different substrate sizes, which increases costs and complexity in substrate processing.
Innovation Solution
A multi-layered substrate carrier with an electrostatic electrode structure is designed to have a nominal dimension exceeding standard substrate sizes, allowing for the simultaneous processing of substrates with varying diameters without reconfiguration, using a bipolar electrode structure to maintain substrates in position through electrostatic forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If substrate carriers are made of materials suitable for elevated temperatures (silicon carbide, silicon, silicon carbide coated graphite), then they can withstand high processing temperatures, but they deform and change size over time, limiting their useful temperature range and requiring frequent replacement
Solution Approach 1:
The substrate carrier is divided into multiple layers (first substrate carrier layer, second substrate carrier layer, third substrate carrier layer) with different materials optimized for specific functions. The lower layer uses high-temperature resistant material (silicon carbide or silicon) for thermal stability, while the upper layer uses low-expansion material (Invar) for dimensional stability during processing.
Solution Approach 2:
The patent employs a composite structure combining different materials: silicon carbide or silicon for the lower layer to withstand high temperatures, Invar for the upper layer to minimize thermal expansion, and aluminum nitride as an intermediate layer. This composite approach allows the carrier to simultaneously withstand elevated temperatures while maintaining dimensional stability.
2Manufacturing precision
If substrate carriers are configured for specific substrate sizes, then they can provide precise support and handling, but multiple carrier configurations are required for different substrate dimensions, increasing cost and complexity
Solution Approach 1:
The substrate carrier is designed with a universal upper surface that can accommodate substrates of various sizes (2-inch, 4-inch, 6-inch, 8-inch diameters) through a single configuration. The carrier's dimensions (e.g., 12-inch diameter) and surface design allow flexible placement of different substrate sizes without requiring multiple specialized carrier types.
Solution Approach 2:
The carrier features a localized recessed region that can be selectively used to support smaller substrates when needed, while the overall carrier structure remains consistent. This allows the same carrier to adapt to different substrate sizes by utilizing different regions of the upper surface.
3Device complexity
If a single substrate carrier is used for multiple substrate sizes, then cost and complexity are reduced, but substrates of different sizes may not be properly supported or positioned
Solution Approach 1:
The carrier includes a recessed region with specific geometric features (e.g., 0.5-inch to 2-inch depth) designed to accommodate smaller substrates. This localized structural variation allows proper support and positioning of different substrate sizes while maintaining a consistent overall carrier design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and cost-effective handling of substrates of different sizes within a standard process chamber, reducing the need for frequent system reconfigurations and minimizing contamination, while maintaining processing quality and extending the carrier's lifespan.
Implementation Method 1
using a bipolar electrode structure to maintain substrates in position through electrostatic forces
Data Source
AI summary
Embodiments of improved substrate carriers are provided herein. In some embodiments, a substrate carrier, includes: a multi-layered disk having upper and lower layers formed of a continuous material and an electrostatic electrode structure disposed therebetween, wherein the multi-layered disk is dimensioned and arranged so as to have a nominal dimension which exceeds a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices, and wherein the multi-layered disk is formed symmetrically about a central axis and defines a substantially planar upper surface.